Microstructural, wetting, and mechanical characteristics of Sn-57.6Bi-0.4Ag alloys doped with metal-organic compounds

Electronic Materials Letters

Volumn 10, Issue 2, 2014, Pages 473-478

  Oh, Sung Tag ^a   Lee, Jong Hyun ^a  

^a Seoul National University of Science and Technology   (South Korea)

Author keywords

doping; mechanical properties; microstructure; Sn Bi Ag alloy; wettability

Indexed keywords

ALLOYS; BRITTLENESS; DOPING (ADDITIVES); FRACTURE MECHANICS; LAMELLAR STRUCTURES; MECHANICAL PROPERTIES; METALS; MICROSTRUCTURE; NICKEL; ORGANIC COMPOUNDS; PALLADIUM; PLASTICITY; SILVER; SILVER ALLOYS; TIN ALLOYS; WETTING;

DOPING CONCENTRATION; DOPING ELEMENTS; LOW TEMPERATURES; MECHANICAL CHARACTERISTICS; METAL ORGANIC COMPOUND; METALLURGICAL AND MECHANICAL PROPERTIES; MICRO-STRUCTURAL; PLASTIC DISPLACEMENT;

TIN;

EID: 84896527575     PISSN: 17388090     EISSN: 20936788     Source Type: Journal    
DOI: 10.1007/s13391-014-8002-x     Document Type: Article

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