Room-temperature Cu-Cu bonding in ambient air achieved by using cone bump

Applied Physics Express

Volumn 4, Issue 1, 2011, Pages

  Watanabe, Naoya ^a   Asano, Tanemasa ^a  

^a KYUSHU UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

AMBIENT AIR; BONDED INTERFACE; CU BONDINGS; CU ELECTRODE; ROOM TEMPERATURE;

EID: 79251573546     PISSN: 18820778     EISSN: 18820786     Source Type: Journal    
DOI: 10.1143/APEX.4.016501     Document Type: Article

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