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Electronic Materials Letters

Volumn 10, Issue 2, 2014, Pages 503-507

Core-shell nanowire based electrical surface fastener used for room-temperature electronic packaging bonding

(3) Wang, Peng a Ju, Yang a Hosoi, Atsushi a

a NAGOYA UNIVERSITY (Japan)

Author keywords

electronic packaging; nanowire; solder bump; surface fastener

Indexed keywords

ELECTRONICS PACKAGING; LOCKS (FASTENERS); MICROELECTRONICS; SOLDERING; SOLDERING ALLOYS; STRESSES;

CORE-SHELL NANOWIRES; ELECTRICAL CONTACTS; ELECTRICAL RESISTANCES; ELECTRONIC ELEMENTS; ELECTRONIC PACKAGING; MICROELECTRONIC PACKAGING; PERFORMANCE DEGRADATION; SOLDER BUMP;

NANOWIRES;

EID: 84896498803 PISSN: 17388090 EISSN: 20936788 Source Type: Journal
DOI: 10.1007/s13391-014-8005-7 Document Type: Article

Times cited : (6)

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