Effects of assembly process parameters on the structure and thermal stability of Sn-capped Cu bump bonds

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2007, Pages 1589-1596

  Huffman, Alan ^a   Lueck, Matthew ^a   Bower, Christopher ^a   Temple, Dorota ^a  

^a RTI INTERNATIONAL   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FORMATION TEMPERATURE; SOLDER BUMPS;

CHEMICAL BONDS; LARGE SCALE SYSTEMS; PARAMETER ESTIMATION; PRESSURE EFFECTS; THERMAL EFFECTS;

THERMODYNAMIC STABILITY;

EID: 35348900689     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2007.374007     Document Type: Conference Paper

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