Influence of cerium oxide (CeO2) nanoparticles on the microstructure and hardness of tin–silver–copper (Sn–Ag–Cu) solders on silver (Ag) surface-finished copper (Cu) substrates

Journal of Materials Science: Materials in Electronics

Volumn 25, Issue 12, 2014, Pages 5375-5387

  Fouzder, Tama ^a   Chan, Y C ^a   Chan, Daniel K ^b  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

^b Chartermate Electronics Limited   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

CERIUM OXIDE; COARSENING; COPPER; GRAIN BOUNDARIES; METALLIZING; MICROHARDNESS; NANOPARTICLES; SILVER ALLOYS; SILVER PLATING; SOLDERING; TIN ALLOYS; TIN OXIDES;

CEO2 NANOPARTICLES; COMPOSITE SOLDER JOINTS; COMPOSITE SOLDERS; FINE MICROSTRUCTURE; GROWTH BEHAVIOR; HARDNESS VALUES; INTERFACIAL MICROSTRUCTURE; PROLONGED REACTION;

COPPER ALLOYS;

EID: 84911935589     PISSN: 09574522     EISSN: 1573482X     Source Type: Journal    
DOI: 10.1007/s10854-014-2316-1     Document Type: Article

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