High density Cu-Cu interconnect bonding for 3-D integration

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2009, Pages 355-359

  Lannon, J ^a   Gregory, C ^a   Lueck, M ^a   Huffman, A ^a   Temple, D ^a  

^a RTI INTERNATIONAL   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

3-D INTEGRATION; BOND STRENGTH; BONDING PARAMETERS; CU INTERCONNECT; DEVICE LAYERS; DEVICE TECHNOLOGIES; ELECTRICAL CONNECTIVITY; ENHANCED PERFORMANCE; FABRICATION PROCESS; HIGH DENSITY; LARGE AREA ARRAYS; LOW RESISTANCE; MECHANICAL STRENGTH; METAL SYSTEMS; MULTIFUNCTIONAL MICROSYSTEMS; OPTIMIZED DEVICES; POLYMER BONDING; PRESSURE AND TEMPERATURE; SMALL PITCH; THERMAL RELIABILITY;

ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS INDUSTRY; MICROSYSTEMS; SURFACE TOPOGRAPHY; THREE DIMENSIONAL;

OPTICAL INTERCONNECTS;

EID: 70349656083     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2009.5074040     Document Type: Conference Paper

References (7)

1. D. Temple, D. Malta, J.M. Lannon M. Lueck, A. Huffman, C. Gregory, J.E. Robinson, P.R. Coffman, T.B. Welch, and M.R. Skokan, "Bonding for 3-D Integration of Heterogeneous Technologies and Materials," ECS Transactions 16, p. 3-8, 2008.
2. D. Temple, J. Lannon, D. Malta, J.E. Robinson, P.R. Coffman, T.B. Welch, M.R. Skokan, A.J. Moll and W.B. Knowlton, "Advances in 3-D Integration of Heterogeneous Materials and Technologies," Proc. of SPIE 6544, p. 65540-65545, 2007.
3. th Electronic Components and Technology Conference, May 2007.
4. K. Tanida, M. Umemoto, N. Tanaka, Y. Tomita, K. Takahashi, "Micro Cu Bump Interconnection on 3D Chip Stacking Technology," Jap. J. of Appl. Phys., vol.43(4B), pp. 2264-2270, 2004.
5. H. Huebner et al, "Face-to-Face Chip Integration with Full Metal Interface," Proc. Adv. Metal. Conf., Mat. Res. Soc., 2002.
6. A. Huffman, J. Lannon, M. Lueck, C. Gregory, and D. Temple, "Fabrication and Characterization of Metal-to- Metal Interconnect Structures for 3-D Integration", to be published in Mater. Res. Soc. Symp. Proc. 2008.
7. B. Swinnen, W. Ruythooren, P. DeMoor, L. Bogaerts, L. Carbonell, K. DeMunck, B. Eyckens, S. Stoukatch, D. Sabuncuoglu Tezcan, Z. Tokei, J. Vaes, J. Van Aelst, E. Beyne, "3D Intergration by Cu-Cu Thermo-compression Bonding of Extremely Thinned Bulk-Si Die Containing 10 μ m Pitch Through-Si Vias," Proc. International Electron Devices Meeting, Dec 2006, pp. 1-4.