Mechanical property evaluation of TSV-Cu micropillar by compression method

Electronic Materials Letters

Volumn 10, Issue 4, 2014, Pages 851-855

  Gu, Ting ^a   Cheng, Ping ^a   Wang, Su ^b   Wang, Huiying ^a   Dai, Xuhan ^a   Wang, Hong ^a   Ding, Guifu ^a  

^a SHANGHAI JIAO TONG UNIVERSITY   (China)

^b Shanghai Sinyang Semiconductor Materials Co Ltd   (China)

Author keywords

mirco compression; thermal treatment; TSV Cu; yield strength

Indexed keywords

HEAT TREATMENT;

COMPRESSION METHODS; MECHANICAL PROPERTY EVALUATION; MICRO COMPRESSIONS; MICRO PILLARS; MICROMACHINING TECHNOLOGIES; MIRCO-COMPRESSION; TEST SAMPLES; TSV-CU;

YIELD STRESS;

EID: 84905379662     PISSN: 17388090     EISSN: 20936788     Source Type: Journal    
DOI: 10.1007/s13391-014-3286-4     Document Type: Article

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