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Journal of Materials Science: Materials in Electronics

Volumn 24, Issue 9, 2013, Pages 3255-3261

The effects of solder deformation on the wetting characteristics and interfacial reaction of Sn-3.5Ag solders on Cu substrates in fluxless soldering

(9) Lee, Jeong Hwan a Ma, Sung Woo a Kim, Young Min a Lee, Jin Su b Kim, Ki Bum b Kim, Jae Myun b Oh, Jae Sung b Kim, Namseog b Kim, Young Ho a

a Hanyang University (South Korea)

b Hynix Semiconductor Inc (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

FLUX-LESS SOLDERING; IMC THICKNESS; INTERFACIAL MICROSTRUCTURE; INTERMETALLIC COMPOUND GROWTHS; SN-3.5AG SOLDERS; SOLDER INTERFACES; WETTING ANGLE; WETTING CHARACTERISTICS;

COPPER COMPOUNDS; DEFORMATION; ENERGY DISPERSIVE SPECTROSCOPY; INTERMETALLICS; OXIDATION; SCANNING ELECTRON MICROSCOPY; SILVER; SOLDERING; SOLDERING ALLOYS; SUBSTRATES; WETTING;

TIN;

EID: 84882656380 PISSN: 09574522 EISSN: 1573482X Source Type: Journal
DOI: 10.1007/s10854-013-1238-7 Document Type: Article

Times cited : (4)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.