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Nanoscale

Volumn 7, Issue 11, 2015, Pages 4984-4994

In situ visualization of metallurgical reactions in nanoscale Cu/Sn diffusion couples

(5) Yin, Qiyue a Gao, Fan b Gu, Zhiyong b Stach, Eric A c Zhou, Guangwen a

a State University of New York (United States)

b University of Massachusetts (United States)

c BROOKHAVEN NATIONAL LABORATORY (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BINARY ALLOYS; COPPER ALLOYS; COPPER COMPOUNDS; HIGH RESOLUTION TRANSMISSION ELECTRON MICROSCOPY; IN SITU PROCESSING; LEAD-FREE SOLDERS; METALLURGY; NANOWIRES; PHASE TRANSITIONS; SOLDERING; TIN ALLOYS; TIN COMPOUNDS; TIN METALLOGRAPHY;

CU-SN INTERMETALLICS; DIFFUSION COUPLE; IN-SITU TRANSMISSION ELECTRON MICROSCOPIES; METALLURGICAL REACTION; METALLURGICAL SOLDERING; RELATIVE LENGTH; SITU VISUALIZATION; TRANSFORMATION PATHWAYS;

COPPER METALLOGRAPHY;

EID: 84924310202 PISSN: 20403364 EISSN: 20403372 Source Type: Journal
DOI: 10.1039/c4nr06757f Document Type: Article

Times cited : (31)

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