Recent advances of nanolead-free solder material for low processing temperature interconnect applications

Microelectronics Reliability

Volumn 53, Issue 12, 2013, Pages 1968-1978

  Jiang, Hongjin ^a   Moon, Kyoung Sik ^b   Wong, C P ^c  

^a INTEL CORPORATION   (United States)

^b Georgia Institute of Technology   (United States)

^c CHINESE UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

INTERCONNECT APPLICATIONS; LOW PROCESSING TEMPERATURE; MICROELECTRONIC PACKAGING; NANOPARTICLE SURFACE; ORGANIC MOLECULES; PARTICLE SIZE CONTROL; SIZE-DEPENDENT MELTING; SOLDER MATERIAL;

MICROELECTRONICS; PACKAGING MATERIALS;

SYNTHESIS (CHEMICAL);

EID: 84888006211     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2013.04.005     Document Type: Article

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