Characterization and solderability of cold sprayed Sn-Cu coatings on Al and Cu substrates

Surface and Coatings Technology

Volumn 204, Issue 9-10, 2010, Pages 1395-1404

  Li, J F ^a   Agyakwa, P A ^a   Johnson, C M ^a   Zhang, D ^a   Hussain, T ^a   McCartney, D G ^a  

^a UNIVERSITY OF NOTTINGHAM   (United Kingdom)

Author keywords

Cold spraying; Photoelectron spectroscopy; Roughness; Tin; Tin oxide; Transmission electron microscopy (TEM)

Indexed keywords

BROKEN DOWN; COATING SURFACE; COATING THICKNESS; COLD SPRAYING; CU SUBSTRATE; DIRECT BONDED COPPERS; ELECTRONIC PACKAGING; FEEDSTOCK POWDERS; FLUX-LESS SOLDERING; OXIDE SHELL; ROUGHNESS; ROUGHNESS ANALYSIS; SCANNING ELECTRON MICROSCOPE; SOLDER JOINTS; SOLDER LAYERS; SOLDERABILITY; STATISTICAL ANALYSIS; SUBSTRATE TYPES; TEM;

CHIP SCALE PACKAGES; ELECTRONS; FLIP CHIP DEVICES; PHOTOELECTRICITY; PHOTOIONIZATION; PHOTONS; SCANNING ELECTRON MICROSCOPY; SOLDERING; SOLDERING ALLOYS; SPECTRUM ANALYSIS; SUBSTRATES; THICKNESS MEASUREMENT; TIN; TIN ALLOYS; TRANSMISSION ELECTRON MICROSCOPY; X RAY PHOTOELECTRON SPECTROSCOPY;

SPRAYED COATINGS;

EID: 71049142549     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2009.09.025     Document Type: Article

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