Fast diffusion and void formation in a two-segment copper-tin lead-free nanowire system with one-dimensional confinement

Science of Advanced Materials

Volumn 4, Issue 8, 2012, Pages 881-887

  Gao, Fan ^a   Liu, Zhenyu ^b   Zhou, Guangwen ^c   Yang, Judith C ^b   Gu, Zhiyong ^a  

^a University of Massachusetts   (United States)

^b University of Pittsburgh   (United States)

^c State University of New York   (United States)

Author keywords

Copper tin; Diffusion; Lead free solders; Nanoelectronics assembly; Nanowires

Indexed keywords

EID: 84871257420     PISSN: 19472935     EISSN: 19472943     Source Type: Journal    
DOI: 10.1166/sam.2012.1361     Document Type: Article

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