Interfacial compounds growth of SnAgCu(nano La2O3)/Cu solder joints based on experiments and FEM

Journal of Alloys and Compounds

Volumn 635, Issue , 2015, Pages 55-60

  Zhang, Liang ^a   Gao, Li Li ^b  

^a JIANGSU NORMAL UNIVERSITY   (China)

^b Shanghai Institute of Radio Equipment   (China)

Author keywords

Activated energy; Fatigue life; Growth kinetic; Intermetallic compounds

Indexed keywords

ACTIVATION ENERGY; CRACKS; DIFFUSION; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; GROWTH KINETICS; INTERMETALLICS; NANOPARTICLES; REACTION KINETICS; SOLDERING ALLOYS; TIN;

ACTIVATED ENERGY; FINITE ELEMENT SIMULATIONS; INTERFACE REACTIONS; INTERFACIAL COMPOUNDS; LENGTH OF CRACK; SNAGCU ALLOYS; THERMAL CYCLIC LOADING; VON MISES STRESS;

LEAD-FREE SOLDERS;

EID: 84923770009     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2015.02.110     Document Type: Article

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