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Volumn 69, Issue 3, 2013, Pages 254-257
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Fe addition to Sn-3.5Ag solder for the suppression of Kirkendall void formation
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Author keywords
Aging; Annealing; Auger electron spectroscopy (AES); Metallizations; Segregation
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Indexed keywords
AUGER ELECTRON SPECTROSCOPIES (AES);
ELECTROPLATING PROCESS;
KIRKENDALL VOID;
METALLIZATIONS;
SN-3.5AG SOLDERS;
SOLDER JOINTS;
SULFATE BATH;
UNDER BUMP METALLIZATION;
AGING OF MATERIALS;
ANNEALING;
AUGER ELECTRON SPECTROSCOPY;
ELECTROPLATING;
METALLIZING;
SEGREGATION (METALLOGRAPHY);
SILVER;
SOLDERING ALLOYS;
TIN;
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EID: 84878576279
PISSN: 13596462
EISSN: None
Source Type: Journal
DOI: 10.1016/j.scriptamat.2013.04.010 Document Type: Article |
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Times cited : (26)
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References (14)
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