Improved creep resistance and thermal behavior of Ni-doped Sn-3.0Ag-0.5Cu lead-free solder

Journal of Alloys and Compounds

Volumn 587, Issue , 2014, Pages 32-39

  El Daly, A A ^a   El Taher, A M ^a   Dalloul, T R ^b  

^a Zagazig University   (Egypt)

^b ISLAMIC UNIVERSITY OF GAZA   (Palestine)

Author keywords

Lead free solder alloys; Mechanical properties; Microstructure; Thermal properties

Indexed keywords

DISLOCATION MOVEMENT; DISLOCATION PILEUP; ELECTRICAL COMPONENTS; EUTECTIC COLONIES; LEAD-FREE SOLDER ALLOY; MICROSTRUCTURE ANALYSIS; SOLIDUS TEMPERATURE; SUBSTITUTIONAL DEFECTS;

ATOMS; CREEP RESISTANCE; DISLOCATIONS (CRYSTALS); FRACTURE; MECHANICAL PROPERTIES; MICROSTRUCTURE; NICKEL; SILVER; SILVER ALLOYS; SOLDERED JOINTS; SOLDERING ALLOYS; THERMODYNAMIC PROPERTIES;

TIN;

EID: 84887597131     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2013.10.148     Document Type: Article

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