Evaluation of creep properties for Sn-Ag-Cu micro solder joint by multi-temperature stress relaxation test

Microelectronics Reliability

Volumn 52, Issue 7, 2012, Pages 1435-1440

  Kanda, Yoshihiko ^a   Kariya, Yoshiharu ^a  

^a SHIBAURA INSTITUTE OF TECHNOLOGY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CREEP CONSTITUTIVE EQUATIONS; CREEP PROPERTIES; LOW STRESS; SN-AG-CU; SOLDER BALLS; SOLDER JOINTS; STRESS EXPONENTS; STRESS RELAXATION TESTS; THREE TEMPERATURE;

ACTIVATION ENERGY; CREEP; MICROSTRUCTURE; SILVER; TIN; TIN ALLOYS;

INTERMETALLICS;

EID: 84861830309     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2012.02.006     Document Type: Article

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