-
1
-
-
33748582367
-
Silicon CMOS devices beyond scaling
-
DOI 10.1147/rd.504.0339
-
W. Haensch, E. J. Nowak, R. H. Dennard, P. M. Solomon, A. Bryant, O. H. Dokumaci, A. Kumar, X. Wang, J. B. Johnson, and M. V. Fischetti, "Silicon CMOS devices beyond scaling," IBM J. Res. Develop., vol. 50, no. 4, pp. 339-361, Jul. 2006. (Pubitemid 44375468)
-
(2006)
IBM Journal of Research and Development
, vol.50
, Issue.4-5
, pp. 339-361
-
-
Haensch, W.1
Nowak, E.J.2
Dennard, R.H.3
Solomon, P.M.4
Bryant, A.5
Dokumaci, O.H.6
Kumar, A.7
Wang, X.8
Johnson, J.B.9
Fischetti, M.V.10
-
2
-
-
1842865629
-
Turning silicon on its edge
-
Jan-Feb
-
E. J. Nowak, I. Aller, T. Ludwig, K. Kim, R. V. Joshi, C.-T. Chuang, K. Bernstein, and R. Puri, "Turning silicon on its edge," IEEE Circuits Devices Mag., vol. 20, no. 1, pp. 20-31, Jan.-Feb. 2004.
-
(2004)
IEEE Circuits Devices Mag
, vol.20
, Issue.1
, pp. 20-31
-
-
Nowak, E.J.1
Aller, I.2
Ludwig, T.3
Kim, K.4
Joshi, R.V.5
Chuang, C.-T.6
Bernstein, K.7
Puri, R.8
-
3
-
-
84856296776
-
Transport analysis based 3D TCAD capacitance extraction for sub-32 nm SRAM structures
-
Feb
-
A. N. Bhoj and R. V. Joshi, "Transport analysis based 3D TCAD capacitance extraction for sub-32 nm SRAM structures," IEEE Electron Device Lett., vol. 33, no. 2, pp. 158-160, Feb. 2012.
-
(2012)
IEEE Electron Device Lett
, vol.33
, Issue.2
, pp. 158-160
-
-
Bhoj, A.N.1
Joshi, R.V.2
-
4
-
-
84871981217
-
Efficient methodologies for 3D-TCAD modeling of emerging devices and circuits
-
Jan to be published
-
A. N. Bhoj, R. V. Joshi, and N. K. Jha, "Efficient methodologies for 3D-TCAD modeling of emerging devices and circuits," IEEE Trans. Comput.-Aided Design, Jan. 2013, to be published.
-
(2013)
IEEE Trans. Comput.-Aided Design
-
-
Bhoj, A.N.1
Joshi, R.V.2
Jha, N.K.3
-
5
-
-
77950113512
-
FinFET resistance mitigation through design and process optimization
-
Apr
-
C. Wang, J. Chang, C.-H. Lin, A. Kumar, A. Gehring, J. Cho, A. Majumdar, A. Bryant, Z. Ren, K. Chan, T. Kanarsky, X. Wang, O. Dokumaci, M. Guillorn, M. Khater, Q. Yang, X. Li, M. Naeem, J. Holt, Y. Moon, J. King, J. Yates, Y. Zhang, D.-G. Park, C. Ouyang, and W. Haensch, "FinFET resistance mitigation through design and process optimization," in Proc. Int. Symp. VLSI Technology, Syst. Appl., Apr. 2009, pp. 127-128.
-
(2009)
Proc. Int. Symp. VLSI Technology, Syst. Appl
, pp. 127-128
-
-
Wang, C.1
Chang, J.2
Lin, C.-H.3
Kumar, A.4
Gehring, A.5
Cho, J.6
Majumdar, A.7
Bryant, A.8
Ren, Z.9
Chan, K.10
Kanarsky, T.11
Wang, X.12
Dokumaci, O.13
Guillorn, M.14
Khater, M.15
Yang, Q.16
Li, X.17
Naeem, M.18
Holt, J.19
Moon, Y.20
King, J.21
Yates, J.22
Zhang, Y.23
Park, D.-G.24
Ouyang, C.25
Haensch, W.26
more..
-
6
-
-
78650572362
-
Non-planar device architecture for 15 nm node: FinFET or trigate
-
Oct
-
C. H. Lin, J. Chang, M. Guillorn, A. Bryant, P. Oldiges, and W. Haensch, "Non-planar device architecture for 15 nm node: FinFET or trigate" in Proc. Int. SOI Conf., Oct. 2010, pp. 1-2.
-
(2010)
Proc. Int. SOI Conf.
, pp. 1-2
-
-
Lin, C.H.1
Chang, J.2
Guillorn, M.3
Bryant, A.4
Oldiges, P.5
Haensch, W.6
-
7
-
-
33847760263
-
Sidewall transfer process and selective gate sidewall spacer formation technology for sub-15nm FinFET with elevated source/drain extension
-
1609488, IEEE International Electron Devices Meeting, 2005 IEDM - Technical Digest
-
A. Kaneko, A. Yagishita, K. Yahashi, T. Kubota, M. Omura, K. Matsuo, I. Mizushima, K. Okano, H. Kawasaki, S. Inaba, T. Izumida, T. Kanemura, N. Aoki, K. Ishimaru, H. Ishiuchi, K. Suguro, K. Eguchi, and Y. Tsunashima, "Sidewall transfer process and selective gate sidewall spacer formation technology for sub-15 nm FinFET with elevated source/drain extension," in Proc. Int. Electron. Devices Meeting, Dec. 2005, pp. 844-847. (Pubitemid 46370982)
-
(2005)
Technical Digest - International Electron Devices Meeting, IEDM
, vol.2005
, pp. 844-847
-
-
Kaneko, A.1
Yagishita, A.2
Yahashi, K.3
Kubota, T.4
Omura, M.5
Matsuo, K.6
Mizushima, I.7
Okano, K.8
Kawasaki, H.9
Inaba, S.10
Izumida, T.11
Kanemura, T.12
Aoki, N.13
Ishimaru, K.14
Ishiuchi, H.15
Suguro, K.16
Eguchi, K.17
Tsunashima, Y.18
-
8
-
-
42549097034
-
Improvement of drive current in bulk-FinFET using full 3D process/device simulations
-
Sep
-
T. Kanemura, T. Izumida, N. Aoki, M. Kondo, S. Ito, T. Enda, K. Okano, H. Kawasaki, A. Yagishita, A. Kaneko, S. Inaba, M. Nakamura, K. Ishimaru, K. Suguro, K. Eguchi, and H. Ishiuchi, "Improvement of drive current in bulk-FinFET using full 3D process/device simulations," in Proc. Int. Conf. Simul. Semicond. Process. Devices, Sep. 2006, pp. 131-134.
-
(2006)
Proc. Int. Conf. Simul. Semicond. Process. Devices
, pp. 131-134
-
-
Kanemura, T.1
Izumida, T.2
Aoki, N.3
Kondo, M.4
Ito, S.5
Enda, T.6
Okano, K.7
Kawasaki, H.8
Yagishita, A.9
Kaneko, A.10
Inaba, S.11
Nakamura, M.12
Ishimaru, K.13
Suguro, K.14
Eguchi, K.15
Ishiuchi, H.16
-
9
-
-
79957590270
-
Aggressively scaled strained-silicon-on-insulator undoped-body high-/metal-gate nFinFETs for high-performance logic applications
-
Jun
-
K. Maitra, A. Khakifirooz, P. Kulkarni, V. S. Basker, J. Faltermeier, H. Jagannathan, H. Adhikari, C.-C. Yeh, N. R. Klymko, K. Saenger, T. Standaert, R. J. Miller, B. Doris, V. K. Paruchuri, D. McHerron, J. O'Neil, E. Leobundung, and H. Bu, "Aggressively scaled strained-silicon-on-insulator undoped-body high-/metal-gate nFinFETs for high-performance logic applications," IEEE Electron. Device Lett., vol. 32, no. 6, pp. 713-715, Jun. 2011.
-
(2011)
IEEE Electron. Device Lett
, vol.32
, Issue.6
, pp. 713-715
-
-
Maitra, K.1
Khakifirooz, A.2
Kulkarni, P.3
Basker, V.S.4
Faltermeier, J.5
Jagannathan, H.6
Adhikari, H.7
Yeh, C.-C.8
Klymko, N.R.9
Saenger, K.10
Standaert, T.11
Miller, R.J.12
Doris, B.13
Paruchuri, V.K.14
McHerron, D.15
O'Neil, J.16
Leobundung, E.17
Bu, H.18
-
10
-
-
77952411137
-
Challenges and solutions of FinFET integration in an SRAM cell and a logic circuit for 22 nm node and beyond
-
Dec
-
H. Kawasaki, V. S. Basker, T. Yamashita, C.-H. Lin, Y. Zhu, J. Faltermeier, S. Schmitz, J. Cummings, S. Kanakasabapathy, H. Adhikari, H. Jagannathan, A. Kumar, K. Maitra, J. Wang, C.-C. Yeh, C. Wang, M. Khater, M. Guillorn, N. Fuller, J. Chang, L. Chang, R. Muralidhar, A. Yagishita, R. Miller, Q. Ouyang, Y. Zhang, V. K. Paruchuri, H. Bu, B. Doris, M. Takayanagi, W. Haensch, D. McHerron, J. O'Neill, and K. Ishimaru, "Challenges and solutions of FinFET integration in an SRAM cell and a logic circuit for 22 nm node and beyond," in Proc. Int. Electron Devices Meeting, Dec. 2009, pp. 1-4.
-
(2009)
Proc. Int. Electron Devices Meeting
, pp. 1-4
-
-
Kawasaki, H.1
Basker, V.S.2
Yamashita, T.3
Lin, C.-H.4
Zhu, Y.5
Faltermeier, J.6
Schmitz, S.7
Cummings, J.8
Kanakasabapathy, S.9
Adhikari, H.10
Jagannathan, H.11
Kumar, A.12
Maitra, K.13
Wang, J.14
Yeh, C.-C.15
Wang, C.16
Khater, M.17
Guillorn, M.18
Fuller, N.19
Chang, J.20
Chang, L.21
Muralidhar, R.22
Yagishita, A.23
Miller, R.24
Ouyang, Q.25
Zhang, Y.26
Paruchuri, V.K.27
Bu, H.28
Doris, B.29
Takayanagi, M.30
Haensch, W.31
McHerron, D.32
O'Neill, J.33
Ishimaru, K.34
more..
-
11
-
-
83455169109
-
Analysis of parasitic resistance in double gate FinFETs with different fin lengths
-
Oct
-
X. Yang, K. Maitra, C. Yeh, P. Zeitzoff, M. Raymond, P. Kulkarni, M. Wang, T. Yamashita, V. S. Basker, T. E. Standaert, S. Samavedam, H. Bu, and R. J. Miller, "Analysis of parasitic resistance in double gate FinFETs with different fin lengths," in Proc. Int. SOI Conf., Oct. 2011, pp. 1-2.
-
(2011)
Proc. Int. SOI Conf.
, pp. 1-2
-
-
Yang, X.1
Maitra, K.2
Yeh, C.3
Zeitzoff, P.4
Raymond, M.5
Kulkarni, P.6
Wang, M.7
Yamashita, T.8
Basker, V.S.9
Standaert, T.E.10
Samavedam, S.11
Bu, H.12
Miller, R.J.13
-
12
-
-
43949124548
-
Analysis of the effects of fringing electric field on finFET device performance and structural optimization using 3-D simulation
-
DOI 10.1109/TED.2008.919308
-
H. Zhao, Y. Yeo, S. Rustagi, and G. Samudra, "Analysis of the effects of fringing electric field on FinFET device performance and structural optimization using 3-D simulation," IEEE Trans. Electron Devices, vol. 55, no. 5, pp. 1177-1184, May 2008. (Pubitemid 351698611)
-
(2008)
IEEE Transactions on Electron Devices
, vol.55
, Issue.5
, pp. 1177-1184
-
-
Zhao, H.1
Yeo, Y.-C.2
Rustagi, S.C.3
Samudra, G.S.4
-
13
-
-
34147183634
-
Analysis of geometry-dependent parasitics in multifin double-gate FinFETs
-
DOI 10.1109/TED.2007.891252
-
W. Wu and M. Chan, "Analysis of geometry-dependent parasitics in multifin double-gate FinFETs," IEEE Trans. Electron Devices, vol. 54, no. 4, pp. 692-698, Apr. 2007. (Pubitemid 46563361)
-
(2007)
IEEE Transactions on Electron Devices
, vol.54
, Issue.4
, pp. 692-698
-
-
Wu, W.1
Chan, M.2
-
14
-
-
51949118252
-
FinFET performance advantage at 22 nm: An AC perspective
-
Jun
-
M. Guillorn, J. Chang, A. Bryant, N. Fuller, O. Dokumaci, X. Wang, J. Newbury, K. Babich, J. Ott, B. Haran, R. Yu, C. Lavoie, D. Klaus, Y. Zhang, E. Sikorski, W. Graham, B. To, M. Lofaro, J. Tornello, D. Koli, B. Yang, A. Pyzyna, D. Neumeyer, M. Khater, A. Yagishita, H. Kawasaki, and W. Haensch, "FinFET performance advantage at 22 nm: An AC perspective," in Proc. Int. Symp. VLSI Technology, Jun. 2008, pp. 12-13.
-
(2008)
Proc. Int. Symp. VLSI Technology
, pp. 12-13
-
-
Guillorn, M.1
Chang, J.2
Bryant, A.3
Fuller, N.4
Dokumaci, O.5
Wang, X.6
Newbury, J.7
Babich, K.8
Ott, J.9
Haran, B.10
Yu, R.11
Lavoie, C.12
Klaus, D.13
Zhang, Y.14
Sikorski, E.15
Graham, W.16
To, B.17
Lofaro, M.18
Tornello, J.19
Koli, D.20
Yang, B.21
Pyzyna, A.22
Neumeyer, D.23
Khater, M.24
Yagishita, A.25
Kawasaki, H.26
Haensch, W.27
more..
-
15
-
-
41149120680
-
Embedded bulk FinFET SRAM cell technology with planar FET peripheral circuit for hp32 nm node and beyond
-
1705221, 2006 Symposium on VLSI Technology, VLSIT - Digest of Technical Papers
-
H. Kawasaki, K. Okano, A. Kaneko, A. Yagishita, T. Izumida, T. Kanemura, K. Kasai, T. Ishida, T. Sasaki, Y. Takeyama, N. Aoki, N. Ohtsuka, K. Suguro, K. Eguchi, Y. Tsunashima, S. Inaba, K. Ishimaru, and H. Ishiuchi, "Embedded bulk FinFET SRAM cell technology with planar FET peripheral circuit for hp32 nm node and beyond," in Proc. Int. Symp. VLSI Technology, Jun. 2006, pp. 70-71. (Pubitemid 351424130)
-
(2006)
Digest of Technical Papers - Symposium on VLSI Technology
, pp. 70-71
-
-
Kawasaki, H.1
Okano, K.2
Kaneko, A.3
Yagishita, A.4
Izumida, T.5
Kanemura, T.6
Kasai, K.7
Ishida, T.8
Sasaki, T.9
Takeyama, Y.10
Aoki, N.11
Ohtsuka, N.12
Suguro, K.13
Eguchi, K.14
Tsunashima, Y.15
Inaba, S.16
Ishimaru, K.17
Ishiuchi, H.18
-
16
-
-
47749125947
-
Direct evaluation of DC characteristic variability in FinFET SRAM cell for 32 nm node and beyond
-
Dec
-
S. Inaba, H. Kawasaki, K. Okano, T. Izumida, A. Yagishita, A. Kaneko, K. Ishimaru, N. Aoki, and Y. Toyoshima, "Direct evaluation of DC characteristic variability in FinFET SRAM cell for 32 nm node and beyond," in Proc. Int. Electron Devices Meeting, Dec. 2007, pp. 487-490.
-
(2007)
Proc. Int. Electron Devices Meeting
, pp. 487-490
-
-
Inaba, S.1
Kawasaki, H.2
Okano, K.3
Izumida, T.4
Yagishita, A.5
Kaneko, A.6
Ishimaru, K.7
Aoki, N.8
Toyoshima, Y.9
-
17
-
-
64549128608
-
Demonstration of highly scaled FinFET SRAM cells with high-/metal gate and investigation of characteristic variability for the 32 nm node and beyond
-
Dec
-
H. Kawasaki, M. Khater, M. Guillorn, N. Fuller, J. Chang, S. Kanakasabapathy, L. Chang, R. Muralidhar, K. Babich, Q. Yang, J. Ott, D. Klaus, E. Kratschmer, E. Sikorski, R. Miller, R. Viswanathan, Y. Zhang, J. Silverman, Q. Ouyang, A. Yagishita, M. Takayanagi, W. Haensch, and K. Ishimaru, "Demonstration of highly scaled FinFET SRAM cells with high-/metal gate and investigation of characteristic variability for the 32 nm node and beyond," in Proc. Int. Electron Device Meeting, Dec. 2008, pp. 1-4.
-
(2008)
Proc. Int. Electron Device Meeting
, pp. 1-4
-
-
Kawasaki, H.1
Khater, M.2
Guillorn, M.3
Fuller, N.4
Chang, J.5
Kanakasabapathy, S.6
Chang, L.7
Muralidhar, R.8
Babich, K.9
Yang, Q.10
Ott, J.11
Klaus, D.12
Kratschmer, E.13
Sikorski, E.14
Miller, R.15
Viswanathan, R.16
Zhang, Y.17
Silverman, J.18
Ouyang, Q.19
Yagishita, A.20
Takayanagi, M.21
Haensch, W.22
Ishimaru, K.23
more..
-
18
-
-
77957867586
-
A 0.063 m2 FinFET SRAM cell demonstration with conventional lithography using a novel integration scheme with aggressively scaled fin and gate pitch
-
Jun
-
V. Basker, T. Standaert, H. Kawasaki, C. Yeh, K. Maitra, T. Yamashita, J. Faltermeier, H. Adhikari, H. Jagannathan, J. Wang, H. Sunamura, S. Kanakasabapathy, S. Schmitz, J. Cummings, A. Inada, C. Lin, P. Kulkarni, Y. Zhu, J. Kuss, T. Yamamoto, A. Kumar, J.Wahl, A. Yagishita, L. F. Edge, R. H. Kim, E. Mclellan, S. J. Holmes, R. C. Johnson, T. Levin, J. Demarest, M. Hane, M. Takayanagi, M. Colburn, V. K. Paruchuri, R. J. Miller, H. Bu, B. Doris, D. McHerron, E. Leobandung, and J. O'Neill, "A 0.063 m2 FinFET SRAM cell demonstration with conventional lithography using a novel integration scheme with aggressively scaled fin and gate pitch," in Proc. Int. Symp. VLSI Technology, Syst. Appl., Jun. 2010, pp. 19-20.
-
(2010)
Proc. Int. Symp. VLSI Technology, Syst. Appl.
, pp. 19-20
-
-
Basker, V.1
Standaert, T.2
Kawasaki, H.3
Yeh, C.4
Maitra, K.5
Yamashita, T.6
Faltermeier, J.7
Adhikari, H.8
Jagannathan, H.9
Wang, J.10
Sunamura, H.11
Kanakasabapathy, S.12
Schmitz, S.13
Cummings, J.14
Inada, A.15
Lin, C.16
Kulkarni, P.17
Zhu, Y.18
Kuss, J.19
Yamamoto, T.20
Kumar, A.21
Wahl, J.22
Yagishita, A.23
Edge, L.F.24
Kim, R.H.25
McLellan, E.26
Holmes, S.J.27
Johnson, R.C.28
Levin, T.29
Demarest, J.30
Hane, M.31
Takayanagi, M.32
Colburn, M.33
Paruchuri, V.K.34
Miller, R.J.35
Bu, H.36
Doris, B.37
McHerron, D.38
Leobandung, E.39
O'Neill, J.40
more..
-
19
-
-
80052685134
-
A 0.021 m2 trigate SRAM cell with aggressively scaled gate and contact pitch
-
Jun
-
M. Guillorn, J. Chang, A. Pyzyna, S. Engelmann, M. Glodde, E. Joseph, R. Bruce, J. A. Ott, A. Majumdar, F. Liu, M. Brink, S. Bangsaruntip, M. Khater, S. Mauer, I. Lauer, C. Lavoie, Z. Zhang, J. Newbury, E. Kratschmer, D. P. Klaus, J. Bucchignano, B. To, W. Graham, E. Sikorski, V. Narayanan, N. Fuller, and W. Haensch, "A 0.021 m2 trigate SRAM cell with aggressively scaled gate and contact pitch," in Proc. Int. Symp. VLSI Technology, Syst. Appl., Jun. 2011, pp. 64-65.
-
(2011)
Proc. Int. Symp. VLSI Technology, Syst. Appl.
, pp. 64-65
-
-
Guillorn, M.1
Chang, J.2
Pyzyna, A.3
Engelmann, S.4
Glodde, M.5
Joseph, E.6
Bruce, R.7
Ott, J.A.8
Majumdar, A.9
Liu, F.10
Brink, M.11
Bangsaruntip, S.12
Khater, M.13
Mauer, S.14
Lauer, I.15
Lavoie, C.16
Zhang, Z.17
Newbury, J.18
Kratschmer, E.19
Klaus, D.P.20
Bucchignano, J.21
To, B.22
Graham, W.23
Sikorski, E.24
Narayanan, V.25
Fuller, N.26
Haensch, W.27
more..
-
20
-
-
80053478137
-
-
[Online]. Available
-
Sentaurus TCAD Tool Suite. (2010) [Online]. Available: http://www.synopsys.com
-
(2010)
Sentaurus TCAD Tool Suite
-
-
-
21
-
-
77952958005
-
SRAM read/write margin enhancements using FinFETs
-
Jun
-
A. Carlson, Z. Guo, S. Balasubramanian, R. Zlatanovici, T. Liu, and B. Nikolic, "SRAM read/write margin enhancements using FinFETs," IEEE Trans. Very Large Scale Integr. (VLSI) Syst., vol. 18, no. 6, pp. 887-900, Jun. 2009.
-
(2009)
IEEE Trans. Very Large Scale Integr. (VLSI) Syst
, vol.18
, Issue.6
, pp. 887-900
-
-
Carlson, A.1
Guo, Z.2
Balasubramanian, S.3
Zlatanovici, R.4
Liu, T.5
Nikolic, B.6
-
22
-
-
80052655324
-
Modeling of width-quantization-induced variations in logic FinFETs for 22 nm and beyond
-
Jun
-
A. Carlson, Z. Guo, S. Balasubramanian, R. Zlatanovici, T.-J. K. Liu, and B. Nikolic, "Modeling of width-quantization-induced variations in logic FinFETs for 22 nm and beyond," in Proc. Int. Symp. VLSI Technology, Syst. Appl., Jun. 2011, pp. 16-17.
-
(2011)
Proc. Int. Symp. VLSI Technology, Syst. Appl.
, pp. 16-17
-
-
Carlson, A.1
Guo, Z.2
Balasubramanian, S.3
Zlatanovici, R.4
Liu, T.-J.K.5
Nikolic, B.6
-
23
-
-
80052677137
-
Sub-25 nm FinFET with advanced fin formation and short channel effect engineering
-
Jun
-
T. Yamashita, V. S. Basker, T. Standaert, C.-C. Yeh, T. Yamamoto, K. Maitra, C.-H. Lin, J. Faltermeier, S. Kanakasabapathy, M. Wang, H. Sunamura, H. Jagannathan, A. Reznicek, S. Schmitz, A. Inada, J. Wang, H. Adhikari, N. Berliner, K.-L. Lee, P. Kulkarni, Y. Zhu, A. Kumar, A. Bryant, S. Wu, T. Kanarsky, J. Cho, E. Mclellan, S. J. Holmes, R. C. Johnson, T. Levin, J. Demarest, J. Li, P. Oldiges, J. Arnold, M. Colburn, M. Hane, D. Mcherron, V. K. Paruchuri, B. Doris, R. J. Miller, H. Bu, M. Khare, J. O'Neill, and E. Leobandung, "Sub-25 nm FinFET with advanced fin formation and short channel effect engineering," in Proc. Int. Symp. VLSI Technology, Syst. Appl., Jun. 2011, pp. 14-15.
-
(2011)
Proc. Int. Symp. VLSI Technology, Syst. Appl.
, pp. 14-15
-
-
Yamashita, T.1
Basker, V.S.2
Standaert, T.3
Yeh, C.-C.4
Yamamoto, T.5
Maitra, K.6
Lin, C.-H.7
Faltermeier, J.8
Kanakasabapathy, S.9
Wang, M.10
Sunamura, H.11
Jagannathan, H.12
Reznicek, A.13
Schmitz, S.14
Inada, A.15
Wang, J.16
Adhikari, H.17
Berliner, N.18
Lee, K.-L.19
Kulkarni, P.20
Zhu, Y.21
Kumar, A.22
Bryant, A.23
Wu, S.24
Kanarsky, T.25
Cho, J.26
McLellan, E.27
Holmes, S.J.28
Johnson, R.C.29
Levin, T.30
Demarest, J.31
Li, J.32
Oldiges, P.33
Arnold, J.34
Colburn, M.35
Hane, M.36
McHerron, D.37
Paruchuri, V.K.38
Doris, B.39
Miller, R.J.40
Bu, H.41
Khare, M.42
O'Neill, J.43
Leobandung, E.44
more..
-
24
-
-
80055022376
-
Critical analysis of 14 nm device options
-
Sep
-
R. Muralidhar, P. Kulkarni, C. Lin, K. Xiu, D. Guo, M. Bajaj, and N. Sathaye, "Critical analysis of 14 nm device options," in Proc. Int. Conf. Simul. Semicond. Process. Devices, Sep. 2011, pp. 5-8.
-
(2011)
Proc. Int. Conf. Simul. Semicond. Process. Devices
, pp. 5-8
-
-
Muralidhar, R.1
Kulkarni, P.2
Lin, C.3
Xiu, K.4
Guo, D.5
Bajaj, M.6
Sathaye, N.7
-
25
-
-
80052656398
-
Scaling of SOI FinFETs down to fin width of 4 nm for the 10 nm technology node
-
Jun
-
J. B. Chang, M. Guillorn, P. M. Solomon, C.-H. Lin, S. U. Engelmann, A. Pyzyna, J. A. Ott, and W. E. Haensch, "Scaling of SOI FinFETs down to fin width of 4 nm for the 10 nm technology node," in Proc. Int. Symp. VLSI Technology, Syst. Appl., Jun. 2011, pp. 12-13.
-
(2011)
Proc. Int. Symp. VLSI Technology, Syst. Appl.
, pp. 12-13
-
-
Chang, J.B.1
Guillorn, M.2
Solomon, P.M.3
Lin, C.-H.4
Engelmann, S.U.5
Pyzyna, A.6
Ott, J.A.7
Haensch, W.E.8
-
27
-
-
0026884997
-
Fast capacitance extraction of general three-dimensional structures
-
Jul
-
K. Nabors, S. Kim, and J. White, "Fast capacitance extraction of general three-dimensional structures," IEEE Trans. Microw. Theory, vol. 40, no. 7, pp. 1496-150, Jul. 1992.
-
(1992)
IEEE Trans. Microw. Theory
, vol.40
, Issue.7
, pp. 1496-2150
-
-
Nabors, K.1
Kim, S.2
White, J.3
-
28
-
-
1242286113
-
Hierarchical block boundary-element method (HBBEM): A fast field solver for 3-D capacitance extraction
-
Jan
-
T. Lu, Z. Wang, and W. Yu, "Hierarchical block boundary-element method (HBBEM): A fast field solver for 3-D capacitance extraction," IEEE Trans. Microw. Theory, vol. 52, no. 1, pp. 10-19, Jan. 2004.
-
(2004)
IEEE Trans. Microw. Theory
, vol.52
, Issue.1
, pp. 10-19
-
-
Lu, T.1
Wang, Z.2
Yu, W.3
-
29
-
-
0037250190
-
Fast capacitance extraction of actual 3-D VLSI interconnects using quasi-multiple medium accelerated BEM
-
Jan
-
W. Yu, Z. Wang, and J. Gu, "Fast capacitance extraction of actual 3-D VLSI interconnects using quasi-multiple medium accelerated BEM," IEEE Trans. Microw. Theory, vol. 51, no. 1, pp. 109-119, Jan. 2003.
-
(2003)
IEEE Trans. Microw. Theory
, vol.51
, Issue.1
, pp. 109-119
-
-
Yu, W.1
Wang, Z.2
Gu, J.3
-
30
-
-
84871955231
-
Hardware-assisted 3D TCAD for predictive capacitance extraction in 32 nm SOI SRAMs
-
Dec
-
A. N. Bhoj, R. V. Joshi, S. Polonsky, R. Kanj, S. Saroop, Y. Tan, and N. K. Jha, "Hardware-assisted 3D TCAD for predictive capacitance extraction in 32 nm SOI SRAMs," in Proc. Int. Electron Devices Mtg., Dec. 2011, pp. 34.7.1-34.7.4.
-
(2011)
Proc. Int. Electron Devices Mtg.
, pp. 3471-3474
-
-
Bhoj, A.N.1
Joshi, R.V.2
Polonsky, S.3
Kanj, R.4
Saroop, S.5
Tan, Y.6
Jha, N.K.7
-
31
-
-
27144449620
-
SRAM cell design for stability methodology
-
T14, 2005 IEEE VLSI-TSA - International Symposium on VLSI Technology - VLSI-TSA - TECH, Proceedings of Technical Papers
-
C. Wann, R. Wong, D. J. Frank, R. Mann, S.-B. Ko, P. Croce, D. Lea, D. Hoyniak, Y.-M. Lee, J. Toomey, M. Weybright, and J. Sudijono, "SRAM cell design for stability methodology," in Proc. Int. Symp. VLSI Technology, Syst. Appl., Aug. 2005, pp. 21-22. (Pubitemid 41500168)
-
(2005)
2005 IEEE VLSI-TSA - International Symposium on VLSI Technology - VLSI-TSA-TECH, Proceedings of Technical Papers
, pp. 21-22
-
-
Wann, C.1
Wong, R.2
Frank, D.J.3
Mann, R.4
Ko, S.-B.5
Croce, P.6
Lea, D.7
Hoyniak, D.8
Lee, Y.-M.9
Toomey, J.10
Weybright, M.11
Sudijono, J.12
|