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Volumn 33, Issue 2, 2012, Pages 158-160

Transport-analysis-based 3-D TCAD capacitance extraction for sub-32-nm SRAM structures

Author keywords

Parasitic capacitance; semiconductor device modeling; SRAM

Indexed keywords

6T-SRAM; BACK END OF THE LINES; CAPACITANCE EXTRACTION; ELECTRICAL BEHAVIORS; HIGH FREQUENCY; MEASURED DATA; MULTICELL; NANOSCALE CIRCUITS; PARASITIC CAPACITANCE; SEMICONDUCTOR DEVICE MODELING; TECHNOLOGY COMPUTER AIDED DESIGN;

EID: 84856296776     PISSN: 07413106     EISSN: None     Source Type: Journal    
DOI: 10.1109/LED.2011.2175359     Document Type: Article
Times cited : (11)

References (7)
  • 1
    • 0026263515 scopus 로고
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    • Nabors, K.1    Kim, S.2    White, J.3    Senturia, S.4
  • 2
    • 1242286113 scopus 로고    scopus 로고
    • Hierarchical block boundary-element method (HBBEM): A fast field solver for 3-D capacitance extraction
    • Jan.
    • T. Lu, Z. Wang, and W. Yu, "Hierarchical block boundary-element method (HBBEM): A fast field solver for 3-D capacitance extraction," IEEE Trans. Microw. Theory Tech., vol. 52, no. 1, pp. 10-19, Jan. 2004.
    • (2004) IEEE Trans. Microw. Theory Tech. , vol.52 , Issue.1 , pp. 10-19
    • Lu, T.1    Wang, Z.2    Yu, W.3
  • 3
    • 0037250190 scopus 로고    scopus 로고
    • Fast capacitance extraction of actual 3-D VLSI interconnects using quasi-multiple medium accelerated BEM
    • Jan.
    • W. Yu, Z. Wang, and J. Gu, "Fast capacitance extraction of actual 3-D VLSI interconnects using quasi-multiple medium accelerated BEM," IEEE Trans. Microw. Theory Tech., vol. 51, no. 1, pp. 109-119, Jan. 2003.
    • (2003) IEEE Trans. Microw. Theory Tech. , vol.51 , Issue.1 , pp. 109-119
    • Yu, W.1    Wang, Z.2    Gu, J.3
  • 5
    • 84856263752 scopus 로고    scopus 로고
    • Tsuprem4/Sentaurus TCAD manuals
    • Synopsys
    • Synopsys, "Tsuprem4/Sentaurus TCAD Manuals," Synopsys, Mountain View, CA. [Online]. Available: www.synopsys.com
    • Synopsys, Mountain View, CA. [Online]
  • 6
    • 0035424354 scopus 로고    scopus 로고
    • Device level modeling of metal-insulator-semiconductor interconnects
    • DOI 10.1109/16.936590, PII S0018938301057318
    • G. Wang, X. Qi, Z. Yu, and R. Dutton, "Device level modeling of metal-insulator-semiconductor interconnects," IEEE Trans. Electron Devices, vol. 48, no. 8, pp. 1672-1682, Aug. 2001. (Pubitemid 32732745)
    • (2001) IEEE Transactions on Electron Devices , vol.48 , Issue.8 , pp. 1672-1682
    • Wang, G.1    Qi, X.2    Yu, Z.3    Dutton, R.W.4
  • 7
    • 84925794148 scopus 로고
    • Techniques for small-signal analysis of semiconductor devices
    • Oct.
    • S. Laux, "Techniques for small-signal analysis of semiconductor devices," IEEE Trans.Electron Devices, vol.ED-32, no. 10, pp. 2028-2037, Oct. 1985.
    • (1985) IEEE Trans.Electron Devices , vol.ED-32 , Issue.10 , pp. 2028-2037
    • Laux, S.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.