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Journal of Materials Science: Materials in Electronics

Volumn 21, Issue 11, 2010, Pages 1174-1180

Investigation on Sn grain number and crystal orientation in the Sn-Ag-Cu/Cu solder joints of different sizes

(3) Yang, Shihua a Tian, Yanhong a Wang, Chunqing a

a HARBIN INSTITUTE OF TECHNOLOGY (China)

Author keywords

[No Author keywords available]

Indexed keywords

CRYSTAL AXIS; CRYSTAL GRAINS; CRYSTALLOGRAPHIC ORIENTATIONS; DIFFERENT SIZES; ELECTRON BACK SCATTER DIFFRACTION; GRAIN NUMBERS; MIS-ORIENTATION; POLARIZED LIGHT MICROSCOPY; SN GRAINS; SNAGCU SOLDER; SOLDER JOINTS; SOLDER PADS; SPECIFIC ORIENTATION;

CRYSTAL ORIENTATION; SILVER; SINGLE CRYSTALS; SOLDERING ALLOYS;

TIN;

EID: 78049528903 PISSN: 09574522 EISSN: 1573482X Source Type: Journal
DOI: 10.1007/s10854-009-0042-x Document Type: Article

Times cited : (31)

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