Improved predictions of lead free solder joint reliability that include aging effects

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2012, Pages 513-531

  Motalab, Mohammad ^a   Cai, Zijie ^a   Suhling, Jeffrey C ^a   Zhang, Jiawei ^a   Evans, John L ^a   Bozack, Michael J ^a   Lall, Pradeep ^a  

^a AUBURN UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACCELERATED LIFE TESTING; AGING CONDITIONS; AGING EFFECTS; AGING PHENOMENA; AGING TIME; ANAND MODEL; CONSTITUTIVE RELATIONS; CREEP COMPLIANCE; CREEP RESPONSE; CREEP STRAIN RATE; CYCLE MODEL; ELECTRONIC ASSEMBLIES; FAILURE CRITERIA; FAILURE MODEL; FINITE ELEMENT; FINITE ELEMENT SIMULATIONS; ISOTHERMAL AGING; KEY MATERIALS; LEAD FREE SOLDERS; LEAD-FREE; LEAD-FREE SOLDER JOINT; MATERIAL PARAMETER; MATHEMATICAL EXPRESSIONS; PLASTIC WORK; RELIABILITY PREDICTION; SAC ALLOY; SOLDER JOINT RELIABILITY; SOLDER JOINTS; SOLDER MATERIAL; STEADY STATE; STRESS STRAIN RELATION; STRESS-STRAIN DATA; STRESS-STRAIN TESTS; THERMAL HISTORY; ULTIMATE STRENGTH; VISCOPLASTIC; VISCOPLASTIC MODELS;

AGING OF MATERIALS; CREEP; ENERGY DISSIPATION; FINITE ELEMENT METHOD; FORECASTING; SOLDERING ALLOYS; STIFFNESS; TESTING; THERMAL CYCLING;

STRENGTH OF MATERIALS;

EID: 84866847482     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2012.6248879     Document Type: Conference Paper

References (26)

1. th Electronic Components and Technology Conference, San Diego, CA, pp. 849-864, 2006.
2. Ma, H., Suhling, J. C., Zhang, Y., Lall, P., and Bozack, M. J., "The Influence of Elevated Temperature Aging on Reliability of Lead Free Solder Joints," Proceedings of the 57th IEEE Electronic Components and Technology Conference, pp. 653-668, Reno, NV, May 29-June 1, 2007.
3. Zhang, Y., Cai, Z., Suhling, J. C., Lall, P., and Bozack, M. J., "The Effects of Aging Temperature on SAC Solder Joint Material Behavior and Reliability," Proceedings of the 58th IEEE Electronic Components and Technology Conference, pp. 99-112, Orlando, FL, May 27-30, 2008.
4. Zhang, Y., Cai, Z., Suhling, J. C., Lall, P., and Bozack, M. J., "The Effects of SAC Alloy Composition on Aging Resistance and Reliability," Proceedings of the 59th IEEE Electronic Components and Technology Conference, pp. 370-389, San Diego, CA, May 27-29, 2009.
5. th Electronic Components and Technology Conference, pp. 1493-1511, Las Vegas, NV, 2010.
6. st Electronic Components and Technology Conference, Orlando, FL, pp. 927-93, 2011.
7. Lee, T. K., Ma, H., Liu, K. C., and Xue, J., "Impact of Isothermal Aging on Long-Term Reliability of Fine-Pitch Ball Grid Array Packages with Sn-Ag-Cu Solder Interconnects: Surface Finish Effects," Journal of Electronic Materials, Vol. 39(12), pp. 2564-2573, 2010.
8. Smetana, J., Coyle, R. Read, P., Popowich, R., Fleming, D., and Sack, T., "Variations in Thermal Cycling Response of Pb-Free Solder Due to Isothermal Preconditioning," Proceedings of the 2011 SMTAI Conference, pp. 641-654, Fort Worth, TX, October 17-20, 2011.
9. Coyle, R., McCormick, H., Osenbach, J., Read, P., Popowich, R., Fleming, D., and Manock, J., "Pb-free Alloy Silver Content and Thermal Fatigue Reliability of a Large Plastic Ball Grid Array (PBGA) Package," SMTA Journal, Vol. 24(1), pp. 27-33, 2011.
10. Coyle, R., Osenbach, J., Read, P., McCormick, H., Fleming, D., Popowich, R., Reid, M., Punch, J., Collins, M., Kinyanjui, R., and Kummer, S., "Dwell Time, Microstructural Dependencies, and the Interpretation of Thermal Fatigue Test Data of SnPb and Pb-Free Solders," Proceedings of the 2009 SMTAI Conference, pp. 384-392, San Diego, CA, October 4-8, 2009.
11. Borgesen, P., Al-Momani, E., and Meilunas, M., "Effect of Dwell Time on the Life of Lead Free BGA Joints in Thermal Cycling," Proceedings of the 2009 SMTAI Conference, pp. 377-383, San Diego, CA, October 4-8, 2009.
12. Coyle, R., Reid, M., Ryan, C., Popowich, R., Read, P., Fleming, D., Collins, M., Punch, J., and Chatterji, I., "The Influence of the Pb-free Solder Alloy Composition and Processing Parameters on Thermal Fatigue Performance of a Ceramic Chip Resistor," Proceedings of the 59th IEEE Electronic Components and Technology Conference, pp. 423-430, San Diego, CA, May 27-29, 2009.
13. Manock, J., Coyle, R., Vaccaro, B, McCormick, H., Popowich, R., Fleming, D., Read, P., Osenbach, J., and Gerlach, D., "Effect of Temperature Cycling Parameters on the Solder Joint Reliability of a Pb-Free PBGA Package," SMTA Journal, Vol. 213, pp. 36-46, 2008.
14. Anand, L., "Constitutive Equations for the Rate-Dependent Deformation of Metals at Elevated Temperatures," Journal of Engineering Materials and Technology, Vol. 104(1), pp. 12-17, 1982.
15. Brown, S., Kim, K., and Anand, L., "An Internal Variable Constitutive Model for Hot Working of Metals," International Journal of Plasticity, Vol. 5(2), pp. 95-130, 1989.
16. th International Conference on Electronics Packaging Technology, pp. 1-6, 2006.
17. Pei, M., and Qu, J., "Constitutive Modeling of Lead-Free Solders," Proceedings of the International Symposium on Advanced Packaging Materials, pp. 45-49, 2005.
18. Mysore, K., Subbarayan, G., Gupta, V., and Zhang, R., "Constitutive and Aging Behavior of Sn3.0Ag0.5Cu Solder Alloy", IEEE Transactions, Electronics Packaging and Manufacturing, Vol. 32(4), pp. 221-232, 2009.
19. Chen, G., Chen, X., and Sakane, M., "Modified Anand Constitutive Model for Lead-Free Solder Sn-3.5Ag," Proceedings of ITHERM 2004, Vol. 2, pp. 447-452, 2004.
20. Amagai, M., Watanabe, M., Omiya, M., Kishimoto, K., and Shibuya, T., "Mechanical Characterization of Sn-Ag Based Lead-Free Solders," Microelectronics Reliability, Vol. 42(6), pp. 951-966, 2002.
21. Kim, Y., Noguchi, H., and Amagai, M., "Vibration Fatigue Reliability of BGA-IC Package With Pb-Free Solder and Pb-Sn Solder," Proceedings of 53rd Electronic Components and Technology Conference, pp. 891-897, 2003.
22. Bai, N., Chen, X., and Gao, H., "Simulation of Uniaxial Tensile Properties for Lead-Free Solders with Modified Anand Model," Materials and Design, Vol. 30, pp. 122-128, 2009.
23. Wilde, J., Becker, K., Thoben, M., Blum, W., Jupitz, T., Wang, G., and Cheng, Z., "Rate Dependent Constitutive Relations Based on Anand Model for 92.5Pb5.0Sn2.5Ag Solder," IEEE Transaction on Advanced Packaging, Vol. 23(3), pp. 408-414, 2000.
24. Wang, G., Cheng, Z., Becker, K., and Wilde, J., "Applying Anand model to Represent the Viscoplastic Deformation Behavior of Solder Alloys," Journal of. Electronic. Packaging, Vol. 123, pp. 247-247, 2001.
25. Rodgers, B., Flood, B., Punch, J., and Waldron, F., "Determination of the Anand Viscoplasticity Model Constants for SnAgCu," in Proceedings of InterPACK 2005, pp. 17-22, 2005.
26. Bhate, D., Chan, D., Subbarayan, G., Chiu, T., Gupta, V., and Edwards, D., "Constitutive Behavior of Sn3.8Ag0. 7Cu and Sn1.0Ag0.5Cu Alloys at Creep and Low Strain Rate Regimes," IEEE Transactions on Components and Packaging Technology, Vol. 31(3), pp. 622-633, 2008.