The effects of aging on the cyclic stress-strain behavior and hysteresis loop evolution of lead free solders

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2011, Pages 927-939

  Mustafa, Muhannad ^a   Cai, Zijie ^a   Suhling, Jeffrey C ^a   Lall, Pradeep ^a  

^a AUBURN UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACCELERATED LIFE TESTING; ASSEMBLY MATERIALS; CONSTITUTIVE BEHAVIORS; CREEP BEHAVIORS; CYCLIC LOADINGS; CYCLIC STRESS STRAIN CURVES; CYCLIC STRESS-STRAIN BEHAVIOR; CYCLIC TESTING; DAMAGE ACCUMULATION; ELECTRONIC ASSEMBLIES; FATIGUE BEHAVIOR; HIGHER TEMPERATURES; LEAD FREE SOLDERS; MECHANICAL LOADING; MECHANICAL STRAIN; NEGATIVE STRESS; SAC ALLOY; SILVER CONTENT; SOLDER ALLOYS; SOLDER COMPOSITION; SOLDER JOINTS; STRAIN ENERGY DENSITY; STRAIN LIMIT; STRESS CONTROL; STRESS-STRAIN; TESTING TEMPERATURE; THERMAL EXPANSION COEFFICIENTS; THERMOMECHANICAL FATIGUE;

ALLOYS; CRACKS; CREEP; CYCLIC LOADS; ELASTICITY; FATIGUE DAMAGE; HYSTERESIS; LOADING; PLASTIC DEFORMATION; SILVER ALLOYS; SOLDERING ALLOYS; STRAIN; STRESS-STRAIN CURVES; STRESSES; STRUCTURAL DESIGN; THERMAL EXPANSION; WELDS;

HYSTERESIS LOOPS;

EID: 79960432720     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2011.5898623     Document Type: Conference Paper

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