Nanomechanical responses of intermetallic phase at the solder joint interface - Crystal orientation and metallurgical effects

Materials Science and Engineering: A

Volumn 534, Issue , 2012, Pages 53-59

  Song, Jenn Ming ^a   Huang, Bo Ron ^b   Liu, Cheng Yi ^c   Lai, Yi Shao ^d   Chiu, Ying Ta ^d   Huang, Tzu Wen ^e  

^a NATIONAL CHUNG HSING UNIVERSITY   (Taiwan)

^b NATIONAL DONG HWA UNIVERSITY   (Taiwan)

^c NATIONAL CENTRAL UNIVERSITY   (Taiwan)

^d ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

^e SWISS FEDERAL LABORATORIES FOR MATERIALS SCIENCE AND TECHNOLOGY   (Switzerland)

Author keywords

Anisotropy; Intermetallics; Mechanical Properties; Microalloying; Phase transformation; Soldering

Indexed keywords

ALLOYING; ALLOYING ELEMENTS; BINARY ALLOYS; COPPER ALLOYS; CRYSTAL ORIENTATION; INTERMETALLICS; LEAD-FREE SOLDERS; NANOINDENTATION; RARE EARTHS; SOLDERING; TIN ALLOYS;

CRYSTALS STRUCTURES; INTERMETALLIC-PHASES; INTERMETALLICS COMPOUNDS; JOINT INTERFACES; MECHANICAL BEHAVIOR; NANO INDENTATION; NANOMECHANICAL RESPONSE; PHASES TRANSFORMATION; SOLDER JOINTS; SOLDERING;

ANISOTROPY;

EID: 84856516792     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2011.11.037     Document Type: Article

References (28)

1. Peng W., Marques M.E. J. Electron. Mater. 2007, 36:1679-1690.
2. Xia Y., Lu C., Xie X. J. Electron. Mater. 2007, 36:1129-1136.
3. Chawla N. Int. Mat. Rev. 2009, 54:368-384.
4. Mattila T.T., Marjamäki P., Kivilahti J.K. IEEE Trans. Electron. Package Manuf. 2009, 29:787-795.
5. Deng X., Koopman M., Chawla N., Chawla K.K. Mater. Sci. Eng. A 2004, 364:240-243.
6. Deng X., Chawla N., Chawla K.K., Koopman M. Acta Mater. 2004, 52:4291-4303.
7. Chromik R.R., Vinci R.P., Alen S.L., Notis M.R. JOM 2003, 55:66-69.
8. Xu L.H., Pang J.H.L. Thin Solid Films 2006, 504:362-366.
9. Yang P.F., Lai Y.S., Jian S.R., Chen J., Chen R.S. Mater. Sci. Eng. A 2008, 485:305-310.
10. Song J.M., Shen Y.L., Su C.W., Lai Y.S., Chiu Y.T. Mater. Trans. 2009, 50:1231-1234.
11. Song J.M., Su C.W., Lai Y.S., Chiu Y.T. J. Mater. Res. 2010, 25:629-632.
12. Jiang L., Chawla N. Scripta Mater. 2010, 63:480-483.
13. Larsson A.K., Stenberg L., Lidin S. Acta Crystallogr. B 1994, 50:636-643.
14. Laurila T., Vuorinen V., Kivilahti J.K. Mater. Sci. Eng. R 2005, 49:1-60.
15. Prakash K.H., Sritharan T. Acta Mater. 2001, 49:2481-2489.
16. Ghosh G., Asta M. J. Mater. Res. 2005, 20:3102-3117.
17. Chen J., Lai Y.S. Microelectron. Reliab. 2009, 49:264-268.
18. Randle V., Powell G. J. Mater. Sci. 1997, 32:561-565.
19. Powder Diffraction File, JCPDS, Newton Square, PA.
20. Oliver W.C., Pharr G.M. J. Mater. Res. 1992, 7:1564-1580.
21. Hay J.L., Pharr G.M. Instrumented Indentation Testing 1990, 232. ASM International. H. Kuhn, D. Medlin (Eds.).
22. Milman Y.V., Galanov B.A., Chugunova S.I. Acta Mater. 1993, 41:2523.
23. Anderson I.E., Harringa J. J. Electron. Mater. 2006, 35:94-106.
24. Chemistry: Molecules, Matter, and Change 2000, W. H. Freeman and Company, New York. 4th ed. L. Jones, P. Atkns (Eds.).
25. Laurila T., Vuorinen V., Paulasto-Kröckel M. Mater. Sci. Eng. R 2010, 68:1-38.
26. Nogita K., Nishimur T. Scripta Mater. 2008, 59:191-194.
27. Nogita K., Gourlay C.M., Nishimura T. JOM 2009, 61:45-51.
28. Nogita K. Intermetallics 2010, 18:145-149.