Experimental characterization and viscoplastic modeling of the temperature dependent material behavior of underfill encapsulants

ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011

Volumn 2, Issue , 2011, Pages 749-761

  Chhanda, Nusrat J ^a   Suhling, Jeffrey C ^a   Lall, Pradeep ^a  

^a AUBURN UNIVERSITY   (United States)

Author keywords

Creep; Encapsulant; Material behavior; Underfill; Viscoelastic; Viscoplastic

Indexed keywords

ENCAPSULANTS; MATERIAL BEHAVIOR; UNDERFILLS; VISCOELASTIC; VISCOPLASTIC;

CHIP SCALE PACKAGES; CREEP TESTING; ENCAPSULATION; EXHIBITIONS; MECHANICAL PROPERTIES; STRESS-STRAIN CURVES; TENSILE TESTING; TORSION TESTING;

CREEP;

EID: 84860334371     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IPACK2011-52209     Document Type: Conference Paper

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