Mechanical properties versus temperature relation of individual phases in Sn-3.0Ag-0.5Cu lead-free solder alloy

Microelectronics Reliability

Volumn 49, Issue 3, 2009, Pages 296-302

  Gao, Feng ^a   Nishikawa, Hiroshi ^b   Takemoto, Tadashi ^b   Qu, Jianmin ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b OSAKA UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BRAZING; CERIUM ALLOYS; COPPER ALLOYS; EUTECTICS; LEAD; MECHANICAL PROPERTIES; SILVER; SILVER ALLOYS; SOLDERED JOINTS; SOLDERING ALLOYS; STRAIN RATE; TIN; TIN ALLOYS; WELDING;

ACTIVITY ENERGIES; CREEP DEFORMATIONS; DWELL TIME; EUTECTIC PHASE; EUTECTIC PHASIS; HIGHER TEMPERATURES; LEAD-FREE SOLDER ALLOYS; NON-HOMOGENEOUS; RATE-CONTROLLING PROCESS; RICH PHASE; SN-3.0 AG-0.5CU; STRAIN RATE SENSITIVITY INDICES; STRAIN-RATE SENSITIVITIES; SUSTAINED LOADINGS; TEMPERATURE REGIMES; TRANSITION TEMPERATURES; YOUNG'S MODULUS;

CREEP;

EID: 60849096075     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2008.10.010     Document Type: Article

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