Nano-scale mechanical responses of Sn-Ag based lead-free solders

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2007, Pages 205-210

  Gao, Feng ^a   Nishikawa, Hiroshi ^a   Takemoto, Tadashi ^a  

^a OSAKA UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ELASTIC MODULI; MICROSTRUCTURE; NANOINDENTATION; SENSITIVITY ANALYSIS; STRAIN RATE; TIN ALLOYS;

CREEP DEFORMATION; STRAIN RATE SENSITIVITY INDEX;

SOLDERING ALLOYS;

EID: 35348928093     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2007.373799     Document Type: Conference Paper

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