Fabrication of an hermetically packaged silicon resonator on LTCC substrate

Microsystem Technologies

Volumn 19, Issue 8, 2013, Pages 1165-1175

  Van Toan, Nguyen ^a   Miyashita, Hidetoshi ^a   Toda, Masaya ^a   Kawai, Yusuke ^a   Ono, Takahito ^a  

^a TOHOKU UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

DEEP REACTIVE ION ETCHING; HERMETICALLY SEALED; LTCC (LOW TEMPERATURE CO-FIRED CERAMIC); MICRO-MECHANICAL; PACKAGING PROCESS; PACKAGING TECHNOLOGIES; SILICON ON INSULATOR WAFERS; SILICON RESONATORS;

ELECTRON BEAM LITHOGRAPHY; MICROELECTRONICS; MICROMECHANICAL RESONATORS; NATURAL FREQUENCIES; RESONATORS; SILICON; SILICON WAFERS;

CHIP SCALE PACKAGES;

EID: 84880806198     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-012-1716-5     Document Type: Article

References (30)

1. Ayazi F (2009) MEMS for integrated timing and spectral processing. In: Proceedings of the IEEE 2009 custom integrated circuits conference (CICC), 987-1-4244-4072-6, pp 65-72. doi: 10.1109/CICC.2009.5280888
2. Esashi M (2008) Wafer level packaging of MEMS. J Micromech Microeng 18(073001):1-13. doi: 10.1088/0960-1317/18/7/073001
3. Fang J, Fu J, Ayazi F (2008) Metal-organic thin-film encapsulation for MEMS. J Micromech Microeng 18(105002):1-8. doi: 10.1088/0960-1317/18/10/105002
4. Mestrom RMC, Fey RHB, Phan KL, Nijimeijer H (2009) Experimental validation of hardening and softening resonances in a clamped-clamped beam MEMS resonator. In: Proceeding of the Eurosensors XXIII conference, pp 812-815. doi: 10.1016/j.proche.2009.07.202
5. Lee JEY, Seshia AA (2009) 5.4-MHz single-crystal silicon wine glass mode disk resonator with quality factor of 2 million. J Sens Actuator A 156(1):28-35. doi: 10.1016/j.sna.2009.02.007
6. Li X, Abe T, Liu Y, Esashi M (2002) Fabrication of high density electrical feed through by deep reactive ion etching of pyrex glass. J Microelectromech Syst 11(6):625-629. doi: 10.1109/JMEMS.2002.805211
7. Lin YW, Li SS, Xie Y, Ren Z, Nguyen CTC (2004) Series-resonator VHF micromechanical resonator reference oscillators. IEEE J Solid-State Circuits 39(12):2477-2491. doi: 10.1109/JSSC.2004.837086
8. Lin YC, Wang WS, Chen LY, Chen MW, Gessner T, Esashi M (2011) Anodically bondable LTCC substrate with novel nano-structured electrical interconnection for MEMS packaging. In: Proceeding of solid-state sensors, actuators and microsystems conference (Transducers 2011), pp 2351-2354. doi: 10.1109/TRANSDUCERS.2011.5969554
9. Mattila T, Kihamaki J, Lamminmaki T, Jaakkola O, Ranatakari P, Oja A, Seppa H, Katelus H, Tittonen I (2002) A 12 MHz micromechanical bulk acoustic mode oscillator. Sens Actuators A: Phys 101(1-2):1-9. doi: 10.1016/S0924- 4247(02)00204-2
10. Melamud R, Kim B, Chandorkar SA, Hopcroft MA, Agarwal M, Jha CM, Kenny TW (2007) Temperature-compensated high-stability silicon resonators. J Appl Phys Lett 90:244107. doi: 10.1063/1.2748092
11. Nakamura K, Takayanagi F, Moro Y, Sanpei H, Onozawa M, Esashi M (2004) Development of RF MEMS switch. In: Proceeding of Advantest technical report, 22, pp 9-15 (Japanese language)
12. Nguyen CTC (2007) MEMS technology for timing and frequency control. IEEE Trans Ultrason Ferroelectr Freq Control 54(2):251-270. doi: 10.1109/TUFFC.2007. 240
13. Nuyen NT, Boellaard E, Pham NP, Kutchoukow VG, Cracium G, Sarro PM (2002) Evaluation procedures for wafer bonding and thinning of interconnect test structures for 3D ICs. In: Proceeding of interconnect technology conference, pp 74-76. doi: 10.1109/IITC.2003.1219717
14. Oberhammer J, Niklaus F, Stemme G (2004) Sealing of adhesive bonded devices on wafer level. Sens Actuators A: Phys 110:407-412. doi: 10.1016/j.sna.2003.06.003
15. Peterson KA, Knudson RT, Garcia EJ, Patel KD, Okandan M, Ho CK, James CD, Rohde SB, Rohrer BR, Smith F, Zawicki LR, Wroblewski BD (2005) LTCC in microelectronics, microsystems, and sensors. In: Proceeding of Mixed design of integrated circuits and systems, pp 23-27
16. Pourkamali S, Ayazi F (2007) Wafer-level encapsulation and sealing of electrostatic HARPSS transducers. In: Proceeding of IEEE Sensor, pp 49-52. doi: 10.1109/ICSENS.2007.4388333
17. Pourkamali S, Ho GK, Ayazi F (2008) Low-impendance VHF and UHF capacitive silicon bulk acoustic wave resonators - part II: measurement and characterization. IEEE Trans Electron Devices vol 54, no 8. doi: 10.1109/TED.2007.901405
18. Ruby RC, Bradley P, Oshmyansky Y, Chien A, Larson JD (2001) Thin film bulk acoustic resonator (FBAR) for wireless applications. In: Proceeding of IEEE ultrasonics symposium, pp 813-821. doi: 10.1109/ULTSYM.2001.991846
19. Rusu C, Persson K, Ottosson B, Billger D (2006) LTCC interconnects in microsystems. J Micromech Microeng 16:S13-S18. doi: 10.1088/0960-1317/16/6/S03
20. Samarao AK, Ayazi F (2009) Temperature compensation of silicon micromechanical resonator via degenerate doping. In: Proceeding of Electron devices meeting (IEDM), pp 1-4. doi: 10.1109/IEDM.2009.5424221
21. Samarao AK, Ayazi F (2011) Combined capacitive and piezoelectric transduction for high performance silicon microresonators. In: Proceeding of micro electro mechanical systems (MEMS 2011), pp 169-172. doi: 10.1109/MEMSYS.2011.5734388
22. Sundaresan K, Gavin KH, Pourkamali S, Ayazi F (2007) Electronically temperature compensated silicon bulk acoustic resonator reference oscillators. IEEE J Solid-State Circuits 42(6):1425-1434. doi: 10.1109/JSSC.2007.896521
23. Tanaka S, Matruzaki S, Mohri M, Okada A, Fukushi H, Esashi M (2011) Wafer level hermetic packaging technology for MEMS using anodically bondable LTCC wafer. In: Proceeding of Micro electro mechanical systems (MEMS 2011), pp 376-379. doi: 10.1109/MEMSYS.2011.5734440
24. Tanaka S, Mohri M, Okada A, Fukushi H, Esashi M (2012) Versatile wafer level hermetic packaging technology using anodically bondable LTCC wafer with compliant porous gold bumps spontaneously formed in wet etched cavities. In: Proceeding of Micro electro mechanical systems (MEMS 2012), pp 369-372. doi: 10.1109/MEMSYS.2012.6170211
25. Thuy TLT, Tanaka S, Esashi M, Hieu NV (2011) A capacitive pressure sensor for sensing circuits with GaN diode bridge. J Emerg Trends Eng Appl Sci 6(2):1068-1072
26. Torres F, Teva J, Lopez JLI, Uranga A, Abadal G, Barniol N, Sanchez-Amores A, Montserrat J, Perezmurano F, Esteve J (2007) Nanometer scale gaps for capacitive transduction improvement on RF-MEMS resonators. J Microeletron Eng 84(5):1384-1387. doi: 10.1016/j.mee.2007.01.062
27. Van Beek JTM, Puers R (2012) A review of MEMS ocsillators for frequency reference and timing applications. J Micromech Microeng 22:013001. doi: 10.1088/0960-1317/22/1/013001
28. Van Beek JTM, Steeneken PG, Giesbers B (2006) A 10 MHz piezoreistive MEMS resonator with high Q. In: Proceeding of International frequency control symposium and exposition 2006 IEEE, pp 475-480. doi: 10.1109/FREQ.2006.275432
29. Weinstein D, Bhave SA, Morita S, Mitarai S, Ikeda K (2009) Frequency scaling and transducer efficiency in internal dielectrically transduced silicon bar resonator. In: Proceeding of solid-state sensors, actuators and microsystems conference, pp 708-711. doi: 10.1109/SENSOR.2009.5285422
30. Zuo C, Sinha N, Spiegel JVD, Piazza G (2008) Multi-frequency pierce oscillators based on piezoelectric AlN contour-mode MEMS resonators. In: Proceeding of frequency control symposium, pp 402-407. doi: 10.1109/FREQ.2008. 4623028