LTCC interconnects in microsystems

Journal of Micromechanics and Microengineering

Volumn 16, Issue 6, 2006, Pages

  Rusu, Cristina ^a   Persson, Katrin ^a   Ottosson, Britta ^a   Billger, Dag ^a  

^a Imego AB The Institute of Micro and Nanotechnology   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

COSTS; ELECTRONICS PACKAGING; MICROSYSTEMS; SILICON WAFERS; STRESS ANALYSIS;

ELECTRICAL INTERCONNECTION; LOW TEMPERATURE CO-FIRED CERAMICS (LTCC); PACKAGING DENSITY;

MEMS;

EID: 34247599500     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/16/6/S03     Document Type: Article

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