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1
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84876928187
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S-Band Radar Transmitter and Receiver LTCC MCM Subassemblies
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CICMT, IMAPS, April 21-24, Munich, Germany
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R. Knudson, F. Smith, L. Zawicki, K. Peterson, "S-Band Radar Transmitter and Receiver LTCC MCM Subassemblies," Poster session, CICMT, IMAPS, April 21-24, 2008, Munich, Germany.
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(2008)
Poster session
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-
Knudson, R.1
Smith, F.2
Zawicki, L.3
Peterson, K.4
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2
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56349113868
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-
G. Barner, Honeywell Federal Manufacturing and Technologies, Kansas City, MO
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G. Barner, Honeywell Federal Manufacturing and Technologies, Kansas City, MO.
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-
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3
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56349111547
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Cofired ceramic microdevices for high temperature and high pressure applications
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Sandia Report SAND 2005-4431 C, July 15, 2005, for presentation at microTAS
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K. D. Patel, K. W. Hukari, and K. A. Peterson, "Cofired ceramic microdevices for high temperature and high pressure applications," Sandia Report SAND 2005-4431 C, July 15, 2005, for presentation at microTAS 2005.
-
(2005)
-
-
Patel, K.D.1
Hukari, K.W.2
Peterson, K.A.3
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4
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56349145744
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S.B. Rohde, K.A. Peterson, Applying new LTCC\LIGA construction techniques in realizing a miniature ion mobility spectrometer, Technical Presentations CD: IMAPS Advanced Technology Workshop on Packaging of MEMS and Related Micro Integrated and Nano Systems, Denver, CO, September 6-8, 2002, Rohde pp. 1-28.
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S.B. Rohde, K.A. Peterson, "Applying new LTCC\LIGA construction techniques in realizing a miniature ion mobility spectrometer," Technical Presentations CD: IMAPS Advanced Technology Workshop on Packaging of MEMS and Related Micro Integrated and Nano Systems, Denver, CO, September 6-8, 2002, Rohde pp. 1-28.
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-
-
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5
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56349109123
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Method for producing a tube,
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U.S. Patent 7,155,812, Jan. 2
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K.A. Peterson, "Method for producing a tube," U.S. Patent 7,155,812, Jan. 2, 2007.
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(2007)
-
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Peterson, K.A.1
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6
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21644450447
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K.A. Peterson, S.B. Rohde, K.B. Pfeifer, T.S. Turner, Novel LTCC fabrication techniques applied to a rolled ion mobility spectrometer, Proc. 204th Mtg. (Electrochem. Soc. Series); v2003 no. 27 156-171, Orlando, Florida, October 12-16, 2003.
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K.A. Peterson, S.B. Rohde, K.B. Pfeifer, T.S. Turner, "Novel LTCC fabrication techniques applied to a rolled ion mobility spectrometer," Proc. 204th Mtg. (Electrochem. Soc. Series); v2003 no. 27 156-171, Orlando, Florida, October 12-16, 2003.
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-
-
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7
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33745770990
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Novel microsystem applications with new techniques in LTCC
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Co-Published by IMAPS and ACerS, pp, Baltimore, Maryland, April 10-13
-
K.A. Peterson, K.D. Patel, C.K. Ho, S.B. Rohde, C.D. Nordquist, C.A. Walker, B.D. Wroblewski, M. Okandan, "Novel microsystem applications with new techniques in LTCC," 1st International Conference on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT), Proceedings CD-ROM; Co-Published by IMAPS and ACerS, pp. 156-173; Baltimore, Maryland, April 10-13, 2005.
-
(2005)
1st International Conference on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT), Proceedings CD-ROM
, pp. 156-173
-
-
Peterson, K.A.1
Patel, K.D.2
Ho, C.K.3
Rohde, S.B.4
Nordquist, C.D.5
Walker, C.A.6
Wroblewski, B.D.7
Okandan, M.8
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8
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84878216431
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Development of LTCC Smart Channels for Integrated Chemical, Temperature, and Flow Sensing
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Co-Published by IMAPS and ACerS, Denver, Colorado, April 25-27
-
C.K. Ho, K.A. Peterson, L.K. McGrath, and T.S. Turner, "Development of LTCC Smart Channels for Integrated Chemical, Temperature, and Flow Sensing," 2nd International Conference on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT), Proceedings CD-ROM; Co-Published by IMAPS and ACerS, Denver, Colorado, April 25-27, 2006.
-
(2006)
2nd International Conference on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT), Proceedings CD-ROM
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-
Ho, C.K.1
Peterson, K.A.2
McGrath, L.K.3
Turner, T.S.4
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9
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56349094827
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Methods and apparatus for optical switching using electrically movable optical fibers,
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U.S. Patent 7,190,862, March 13
-
K.A. Peterson, "Methods and apparatus for optical switching using electrically movable optical fibers," U.S. Patent 7,190,862, March 13, 2007.
-
(2007)
-
-
Peterson, K.A.1
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10
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27844584063
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Microsystem Integration with New Techniques in LTCC
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IMAPS\AcerS Conference Ceramic Interconnect Technology; The Next Generation, April 26-28, Denver, CO, p
-
K.A. Peterson, S.B. Rohde, C.A. Walker, K.D. Patel, T.S. Turner, C.D. Nordquist, "Microsystem Integration with New Techniques in LTCC," Proceedings, IMAPS\AcerS Conference Ceramic Interconnect Technology; The Next Generation, 2004; April 26-28, 2004, Denver, CO, p. 19-26.
-
(2004)
Proceedings
, pp. 19-26
-
-
Peterson, K.A.1
Rohde, S.B.2
Walker, C.A.3
Patel, K.D.4
Turner, T.S.5
Nordquist, C.D.6
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11
-
-
0035862468
-
The fabrication of smooth, sub-millimeter open channels and internal channels in ceramics and ceramic composites without machining
-
J.G. Lee, H.W. Shin, E.D. Case, P. Kwon, "The fabrication of smooth, sub-millimeter open channels and internal channels in ceramics and ceramic composites without machining, J. Mat. Sci. Let., 20, 2001, 107-109.
-
(2001)
J. Mat. Sci. Let
, vol.20
, pp. 107-109
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-
Lee, J.G.1
Shin, H.W.2
Case, E.D.3
Kwon, P.4
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12
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56349091969
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Thick Film Technologies website
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Thick Film Technologies website: http:\\www.thickfilmtech.com\othrprod. html
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-
-
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13
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84878230921
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LTCC Microsystems and Microsystem Packaging and Integration Applications
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Co-Published by IMAPS and ACerS, Denver, Colorado, April 25-27
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K.A. Peterson, K.D. Patel, C.K. Ho, B.R. Rohrer, C.D. Nordquist, B.D. Wroblewski, K.B. Pfeifer, "LTCC Microsystems and Microsystem Packaging and Integration Applications," 2nd International Conference on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT), Proceedings CD-ROM; Co-Published by IMAPS and ACerS, Denver, Colorado, April 25-27, 2006.
-
(2006)
2nd International Conference on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT), Proceedings CD-ROM
-
-
Peterson, K.A.1
Patel, K.D.2
Ho, C.K.3
Rohrer, B.R.4
Nordquist, C.D.5
Wroblewski, B.D.6
Pfeifer, K.B.7
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14
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0041828722
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Novel Structures in Ceramic Interconnect Technology
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Denver, CO, April 7-9
-
K.A. Peterson, S.B. Rhode, T.S. Turner, A.L. Casias, "Novel Structures in Ceramic Interconnect Technology," Proceedings, IMAPS Ceramic Interconnect Technology Conference, Denver, CO, April 7-9, 2003, pp. 223-228.
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(2003)
Proceedings, IMAPS Ceramic Interconnect Technology Conference
, pp. 223-228
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-
Peterson, K.A.1
Rhode, S.B.2
Turner, T.S.3
Casias, A.L.4
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15
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84878247304
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Low temperature cofired ceramic microfluidic microsystems for high temperature and high pressure applications
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Co-published by IMAPS and ACerS, Denver, Colorado, April 25-27
-
K.D. Patel, K.A. Peterson, K.W. Hukari, "Low temperature cofired ceramic microfluidic microsystems for high temperature and high pressure applications," 2nd International Conference on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT), Proceedings CD-ROM; Co-published by IMAPS and ACerS, Denver, Colorado, April 25-27, 2006.
-
(2006)
2nd International Conference on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT), Proceedings CD-ROM
-
-
Patel, K.D.1
Peterson, K.A.2
Hukari, K.W.3
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16
-
-
84878234785
-
New Sacrificial Layer Based Screen-Printing Process for Free-Standing Thick Films Applied to MEMS,
-
Denver, USA
-
C. Lucat, P. Ginet, and F. Menil, "New Sacrificial Layer Based Screen-Printing Process for Free-Standing Thick Films Applied to MEMS, "in Proceedings of Ceramic Interconnect and Ceramic Microsystems Technologies (Denver, USA), 2007.
-
(2007)
Proceedings of Ceramic Interconnect and Ceramic Microsystems Technologies
-
-
Lucat, C.1
Ginet, P.2
Menil, F.3
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17
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56349122745
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LTCC in microsystems
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September
-
K. Peterson, K. Patel, C. Ho, S. Rohde, B. Rohrer, M. Okandan, O. Spahn, T. Turner, D. De Smet, "LTCC in microsystems," Proceedings of the XXXI International Conference of IMAPS Poland Chapter, Rzeszow-Krasiczyn, 23-26 September, 2007, 127-133.
-
(2007)
Proceedings of the XXXI International Conference of IMAPS Poland Chapter, Rzeszow-Krasiczyn, 23-26
, pp. 127-133
-
-
Peterson, K.1
Patel, K.2
Ho, C.3
Rohde, S.4
Rohrer, B.5
Okandan, M.6
Spahn, O.7
Turner, T.8
De Smet, D.9
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18
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56349117198
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Fabrication of LTCC micro-fluidic devices using sacrificial carbon layers
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Co-Published by IMAPS and ACerS, pp, Baltimore, Maryland, April 10-13
-
H. Birol, T. Maeder, C. Jacq, G. Corradini, R. Passerini, Y. Gournier, S. Straessler, P. Ryser, "Fabrication of LTCC micro-fluidic devices using sacrificial carbon layers," 1st International Conference on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT), Proceedings CD-ROM; Co-Published by IMAPS and ACerS, pp. 59-66; Baltimore, Maryland, April 10-13, 2005.
-
(2005)
1st International Conference on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT), Proceedings CD-ROM
, pp. 59-66
-
-
Birol, H.1
Maeder, T.2
Jacq, C.3
Corradini, G.4
Passerini, R.5
Gournier, Y.6
Straessler, S.7
Ryser, P.8
-
19
-
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34548782701
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Portable, Chronic Neural Interface System Design for Sensory Augmentation
-
Kohala Coast, Hawaii, USA, May 2-5
-
S.P. Buerger, R.H. Olsson III, K.E. Wojciechowski, E. Yepez III, D. Novick, K.A. Peterson, T. Turner, J.W. Wheeler, B.R. Rohrer, D.K. Kholwadwala, "Portable, Chronic Neural Interface System Design for Sensory Augmentation," Proceedings of the 3rd International IEEE EMBS Conference on Neural Engineering, Kohala Coast, Hawaii, USA, May 2-5, 2007
-
(2007)
Proceedings of the 3rd International IEEE EMBS Conference on Neural Engineering
-
-
Buerger, S.P.1
Olsson III, R.H.2
Wojciechowski, K.E.3
Yepez III, E.4
Novick, D.5
Peterson, K.A.6
Turner, T.7
Wheeler, J.W.8
Rohrer, B.R.9
Kholwadwala, D.K.10
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20
-
-
27844483167
-
Designing with Heralock 2000 Self-Constrained LTCC Tape
-
Providence, RI, May 2-3
-
E. Amaya, "Designing with Heralock 2000 Self-Constrained LTCC Tape," Technical Presentations, IMAPS ATW: Ceramic Applications Microwave and Photonic Packaging, Providence, RI, May 2-3, 2002.
-
(2002)
Technical Presentations, IMAPS ATW: Ceramic Applications Microwave and Photonic Packaging
-
-
Amaya, E.1
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21
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40449113554
-
-
N.A. Hall, M. Okandan, R. Littrel, D.K. Serkland, G.A. Keeler, K. Peterson, B. Bicen, C.T. Garcia, F.L. Degertekin, Micromachined accleerometers with optical interferometric read-out and integrated electrostatic actuation, J. Microelectromech. Sys., V. 17, No. 1, Feb. 2008, 37-44.
-
N.A. Hall, M. Okandan, R. Littrel, D.K. Serkland, G.A. Keeler, K. Peterson, B. Bicen, C.T. Garcia, F.L. Degertekin, Micromachined accleerometers with optical interferometric read-out and integrated electrostatic actuation," J. Microelectromech. Sys., V. 17, No. 1, Feb. 2008, 37-44.
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-
-
-
22
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56349126996
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Ultrasensitive Directional Microphone Arrays for Military Operations in Urban Terrain,
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SAND2007-7419, November, 2007
-
M. Okandan, E.P. Parker, N.A. Hall, K.A. Peterson, P. Resnick, D. Serkland, "Ultrasensitive Directional Microphone Arrays for Military Operations in Urban Terrain," Sandia Report, SAND2007-7419, November, 2007.
-
Sandia Report
-
-
Okandan, M.1
Parker, E.P.2
Hall, N.A.3
Peterson, K.A.4
Resnick, P.5
Serkland, D.6
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23
-
-
0032299361
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Meso (intermediate)-scale electromechanical systems for the measurement and control of sagging in LTCC structures
-
P. Espinoza-Vallejos, J. Zhong, M. Gongora-Rubio, L. Sola-Laguna, J.J. Santiago-Aviles, "Meso (intermediate)-scale electromechanical systems for the measurement and control of sagging in LTCC structures," Mat. Res. Soc. Symp. Proc. Vol. 518, pp. 73-79, 1998.
-
(1998)
Mat. Res. Soc. Symp. Proc
, vol.518
, pp. 73-79
-
-
Espinoza-Vallejos, P.1
Zhong, J.2
Gongora-Rubio, M.3
Sola-Laguna, L.4
Santiago-Aviles, J.J.5
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24
-
-
0038818519
-
Micro heat pipes in low temperature cofire ceramic (LTCC) substrates
-
Packaging Technologies, March
-
W.K. Jones, Y. Liu, and M. Gao, "Micro heat pipes in low temperature cofire ceramic (LTCC) substrates," IEEE Trans. Comp. Packaging Technologies, Vol. 26, No. 1, March 2003, pp. 110-115.
-
(2003)
IEEE Trans. Comp
, vol.26
, Issue.1
, pp. 110-115
-
-
Jones, W.K.1
Liu, Y.2
Gao, M.3
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25
-
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36249017310
-
LTCC - A Fascinating Technology Platform for Miniaturized Devices
-
0277-786, ·
-
U. Schmid, "LTCC - A Fascinating Technology Platform for Miniaturized Devices," Proc. of SPIE Vol. 6589, 65890B, (2007) · 0277-786.
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(2007)
Proc. of SPIE
, vol.6589
-
-
Schmid, U.1
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26
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39149145836
-
Green-tape ceramics. New technological approach for integrating electronics and fluidics in microsystems
-
N. Ibanez-Garcia, C.S. Martinez-Cisneros, F. Valdez, "Green-tape ceramics. New technological approach for integrating electronics and fluidics in microsystems," Trends in Anal. Chem., Vol. 27, No. 1, 2008, 24-33.
-
(2008)
Trends in Anal. Chem
, vol.27
, Issue.1
, pp. 24-33
-
-
Ibanez-Garcia, N.1
Martinez-Cisneros, C.S.2
Valdez, F.3
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27
-
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56349171315
-
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P. Yang, Sandia Laboratories, Albuquerqe, NM, pyang@sandia.gov.
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P. Yang, Sandia Laboratories, Albuquerqe, NM, pyang@sandia.gov.
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28
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0035871550
-
Overview of low temperature co-fired ceramics tape technology for meso-system technology
-
M.R. Gongora-Rubio, P. Espinoza-Vallejos, L. Sola-Laguna, J.J. Santiago-Aviles, "Overview of low temperature co-fired ceramics tape technology for meso-system technology," Sensors and Actuators A 89 (2001) 222-241.
-
(2001)
Sensors and Actuators A
, vol.89
, pp. 222-241
-
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Gongora-Rubio, M.R.1
Espinoza-Vallejos, P.2
Sola-Laguna, L.3
Santiago-Aviles, J.J.4
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30
-
-
0002974733
-
Chemical, Structural and Mechanical Properties of the LTCC Tapes
-
IMAPS, Boston
-
WK Jones, Y Liu, B Larsen, P Wang, and M Zampino, "Chemical, Structural and Mechanical Properties of the LTCC Tapes," Proc. Int. Symp. Microelect., IMAPS, Boston, (2000) 469-473.
-
(2000)
Proc. Int. Symp. Microelect
, pp. 469-473
-
-
Jones, W.K.1
Liu, Y.2
Larsen, B.3
Wang, P.4
Zampino, M.5
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31
-
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27844559857
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Materials and process control technology for LTCC microelectronics packaging
-
IMAPS, Denver
-
KG Ewsuk, CB DiAntonio, F Uribe, SL Monroe, "Materials and process control technology for LTCC microelectronics packaging," Proc. Cer. Intercon. Tech. Conf., IMAPS, Denver, (2004) 1-6.
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(2004)
Proc. Cer. Intercon. Tech. Conf
, pp. 1-6
-
-
Ewsuk, K.G.1
DiAntonio, C.B.2
Uribe, F.3
Monroe, S.L.4
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32
-
-
0034316512
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Microstructure and Phase Development of Buried Resistors in Low Temperature Co-fired Ceramic
-
M.A. Rodriguiz, P. Yang, P. Kotula and D. Dimos, "Microstructure and Phase Development of Buried Resistors in Low Temperature Co-fired Ceramic," J. Electroceram. 5:3, 217-223, 2000.
-
(2000)
J. Electroceram
, vol.5
, Issue.3
, pp. 217-223
-
-
Rodriguiz, M.A.1
Yang, P.2
Kotula, P.3
Dimos, D.4
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33
-
-
0035307497
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Processing, microstructure, and electric properties of buried resistors in low-temperature co-fired ceramics
-
P. Yang, M.A. Rodriguez, P. Kotula, B.K. Miera, and D. Dimos, "Processing, microstructure, and electric properties of buried resistors in low-temperature co-fired ceramics," J. App. Phys. 89:7, 4175-4182, 2001.
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J. App. Phys
, vol.89
, Issue.7
, pp. 4175-4182
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Yang, P.1
Rodriguez, M.A.2
Kotula, P.3
Miera, B.K.4
Dimos, D.5
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34
-
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0032299361
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Meso (intermediate)-scale electromechanical systems for the measurement and control of sagging in LTCC struct-ures
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P Espinoza-Vallejos, J Zhong, M Gongora-Rubio, L Sola-Laguna, JJ Santiago-Aviles, "Meso (intermediate)-scale electromechanical systems for the measurement and control of sagging in LTCC struct-ures," Mat. Res. Soc. Symp. Proc. 518, 1998, 73-79.
-
(1998)
Mat. Res. Soc. Symp. Proc
, vol.518
, pp. 73-79
-
-
Espinoza-Vallejos, P.1
Zhong, J.2
Gongora-Rubio, M.3
Sola-Laguna, L.4
Santiago-Aviles, J.J.5
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35
-
-
0036450212
-
Optical dilatometer for in-situ measurements of warpage effects during firing of LTCC multi layer structures
-
IMAPS, Washington
-
M Wagner, A Roosen, A Stiegelschmitt, D Schwanke, F Bechthold, "Optical dilatometer for in-situ measurements of warpage effects during firing of LTCC multi layer structures, Proc. Int. Symp. Microelect., IMAPS, Washington, (2002) 71-75.
-
(2002)
Proc. Int. Symp. Microelect
, pp. 71-75
-
-
Wagner, M.1
Roosen, A.2
Stiegelschmitt, A.3
Schwanke, D.4
Bechthold, F.5
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36
-
-
1342287011
-
Lifetime prediction for mechanically stressed low temperature co-fired ceramics
-
H Dannheim, U Schmid, A Roosen, "Lifetime prediction for mechanically stressed low temperature co-fired ceramics," J. Eur. Cer. Soc. v24 no. 8 (2004) 2187-92.
-
(2004)
J. Eur. Cer. Soc
, vol.24
, Issue.8
, pp. 2187-2192
-
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Dannheim, H.1
Schmid, U.2
Roosen, A.3
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37
-
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56349142611
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Characterization of the mechanical properties of LTCC Green Tape for the MC4352 MET,
-
SAND97-0497 UC0704, March, 1997
-
F. Uribe, S. Garrett, S. Monroe, and S. Burchett, "Characterization of the mechanical properties of LTCC Green Tape for the MC4352 MET," Sandia Report SAND97-0497 UC0704, March, 1997.
-
Sandia Report
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-
Uribe, F.1
Garrett, S.2
Monroe, S.3
Burchett, S.4
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38
-
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33646225650
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Pressure Sensors built in Low Temperature Co-Fired Ceramic Materials
-
Presented at, September 6-8, Denver
-
D.G. Plumlee, Y. Morales, B. Cheek, A.J. Paris, H.A. Ackler, W.B. Knowlton and A.J. Moll, "Pressure Sensors built in Low Temperature Co-Fired Ceramic Materials," Presented at IMAPS Advanced Technology Workshop on Packaging of MEMS and Releate Micro Integrated Nano Systems, September 6-8, 2002, Denver.
-
(2002)
IMAPS Advanced Technology Workshop on Packaging of MEMS and Releate Micro Integrated Nano Systems
-
-
Plumlee, D.G.1
Morales, Y.2
Cheek, B.3
Paris, A.J.4
Ackler, H.A.5
Knowlton, W.B.6
Moll, A.J.7
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39
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50049118215
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Method of fabricating a multilayer electrical circuit structure,
-
U.S. Patent #5,249,355, October 5
-
D.J. Miehls, F.J. Martin, R.G. Pond, P.S. Fleischner, "Method of fabricating a multilayer electrical circuit structure," U.S. Patent #5,249,355, October 5, 1993.
-
(1993)
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Miehls, D.J.1
Martin, F.J.2
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40
-
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0032299361
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Meso (intermediate)-scale electromechanical systems for the measurement and control of sagging in LTCC structures
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P. Espinoza-Vallejos, J. Zhong, M. Gongora-Rubio, L. Sola-Laguna, J.J. Santiago-Aviles, "Meso (intermediate)-scale electromechanical systems for the measurement and control of sagging in LTCC structures," Mat. Res. Soc. Symp. Proc. Vol. 518, pp. 73-79, 1998.
-
(1998)
Mat. Res. Soc. Symp. Proc
, vol.518
, pp. 73-79
-
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Espinoza-Vallejos, P.1
Zhong, J.2
Gongora-Rubio, M.3
Sola-Laguna, L.4
Santiago-Aviles, J.J.5
-
41
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50049108523
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Method for constructing three dimensional bodies from laminations,
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U.S. Patent #5,779,833, July 14
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J.D. Cawley, A.H. Heuer, W.S. Newman, "Method for constructing three dimensional bodies from laminations," U.S. Patent #5,779,833, July 14, 1998.
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(1998)
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Cawley, J.D.1
Heuer, A.H.2
Newman, W.S.3
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42
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50049085992
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Ceramic monolithic structure having an internal cavity containte therein and a method of preparing the same,
-
U.S. Patent #4,806,295, February 21
-
E.A. Trickett, R.C. Assmus, "Ceramic monolithic structure having an internal cavity containte therein and a method of preparing the same," U.S. Patent #4,806,295, February 21, 1989.
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(1989)
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Trickett, E.A.1
Assmus, R.C.2
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43
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50049120943
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Method of making ceramic article with cavity using LTCC tape,
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U.S. Patent #5,601,673, February 11
-
J.H. Alexander, "Method of making ceramic article with cavity using LTCC tape," U.S. Patent #5,601,673, February 11, 1997.
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(1997)
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Alexander, J.H.1
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44
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50049123159
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Method for fabricating a multilayered structure and the structures formed by the method,
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