Processing treatment of a lead-free Sn-Ag-Cu-Bi solder by rapid laser-beam reflowing and the creep property of its soldered connection

Journal of Materials Processing Technology

Volumn 192-193, Issue , 2007, Pages 539-542

  Zhang, X P ^a   Yu, C B ^a   Zhang, Y P ^a   Shrestha, S ^b   Dorn, L ^b  

^a SOUTH CHINA UNIVERSITY OF TECHNOLOGY   (China)

^b TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

Author keywords

Laser beam treatment; Lead free solder; Reflowing process; Thermal creep

Indexed keywords

CREEP RESISTANCE; GRAIN REFINEMENT; LASER BEAMS; SOLDERED JOINTS; CREEP; LEAD; SILVER; SOLDERING ALLOYS; TIN ALLOYS;

LASER BEAM TREATMENT; LEAD FREE SOLDER; REFLOWING PROCESS; THERMAL CREEP;

SOLDERING ALLOYS; TIN;

CREEP PROPERTIES; LASER-BEAM TREATMENT; LEAD FREE SOLDERS; PROCESSING PERFORMANCE; REFLOWING PROCESS; SOLDERED CONNECTIONS; SUPERIOR CREEP RESISTANCE; THERMAL CREEP;

EID: 34547519994     PISSN: 09240136     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jmatprotec.2007.04.072     Document Type: Article

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