Low-temperature creep of SnPb and SnAgCu solder alloys and reliability prediction in electronic packaging modules

Scripta Materialia

Volumn 68, Issue 8, 2013, Pages 607-610

  Zhang, Yuming ^a,b   Zhu, Honglai ^c   Fujiwara, Masami ^d   Xu, Jinquan ^a   Dao, Ming ^b  

^a SHANGHAI JIAO TONG UNIVERSITY   (China)

^b Massachusetts Institute of Technology   (United States)

^c BEIJING INSTITUTE OF CONTROL ENGINEERING   (China)

^d NIHON UNIVERSITY   (Japan)

Author keywords

Constitutive law; Fatigue; Lead free solder; Low temperature creep; Solder alloy

Indexed keywords

BROAD TEMPERATURE RANGES; CONSTITUTIVE LAW; CREEP DEFORMATIONS; CREEP FAILURE; CREEP TESTS; ELECTRONIC PACKAGING; LEAD FREE SOLDERS; LEAD-FREE SOLDER ALLOY; LOW TEMPERATURES; LOW-TEMPERATURE CREEPS; RELIABILITY PREDICTION; SNAGCU SOLDER; SOLDER ALLOYS; STRESS LEVELS;

ALLOYS; COPPER ALLOYS; ELECTRONICS PACKAGING; FATIGUE OF MATERIALS; NUMERICAL ANALYSIS; TEMPERATURE;

CREEP;

EID: 84873994512     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.scriptamat.2012.12.017     Document Type: Article

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