In-situ observation of fracture behavior of Sn-3.0Ag-0.5Cu lead-free solder during three-point bending tests in ESEM

Materials Science and Engineering: A

Volumn 558, Issue , 2012, Pages 649-655

  Wang, Mingna ^a   Wang, Jianqiu ^a   Feng, Hao ^b   Ke, Wei ^a  

^a INSTITUTE OF METAL RESEARCH   (China)

^b China National Electric Apparatus Research Institute   (China)

Author keywords

Corrosion; Fracture; Lead free solder; Microstructure; Three point bending

Indexed keywords

BENDING TESTS; BINARY ALLOYS; COPPER ALLOYS; COPPER CORROSION; COPPER METALLOGRAPHY; CORROSION; FRACTURE; FRACTURE MECHANICS; INDIUM ALLOYS; INDIUM METALLOGRAPHY; MICROCRACKS; MICROSTRUCTURE; SCANNING ELECTRON MICROSCOPY; SILVER ALLOYS; SILVER METALLOGRAPHY; SOLDERED JOINTS; TERNARY ALLOYS; TIN; TIN METALLOGRAPHY;

CORRODED REGIONS; ENVIRONMENTAL SCANNING ELECTRON MICROSCOPIES (ESEM); FRACTURE BEHAVIOR; IN-SITU OBSERVATIONS; SN-3.0AG-0.5CU; THREE POINT BENDING; THREE-POINT BENDING TEST; VULNERABLE AREA;

LEAD-FREE SOLDERS;

EID: 84866278399     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2012.08.069     Document Type: Article

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