Microstructure and impression creep behavior of lead-free Sn-5Sb solder alloy containing Bi and Ag

Materials Science and Engineering: A

Volumn 547, Issue , 2012, Pages 110-119

  Geranmayeh, A R ^a   Nayyeri, G ^b   Mahmudi, R ^b  

^a ISLAMIC AZAD UNIVERSITY   (Iran)

^b UNIVERSITY OF TEHRAN   (Iran)

Author keywords

Impression creep; Lead free solder; Sn Sb alloy

Indexed keywords

ACTIVATION ENERGY; ANTIMONY ALLOYS; BISMUTH ALLOYS; CREEP; CREEP RESISTANCE; CREEP TESTING; GRAIN BOUNDARIES; LEAD ALLOYS; LEAD-FREE SOLDERS; SILVER ALLOYS; TIN ALLOYS;

BASE ALLOYS; CREEP BEHAVIORS; DISLOCATION CLIMB; HIGH STRESS; IMPRESSION CREEP; LEAD-FREE; LOWER STRESS; SOLDER ALLOYS; STRESS EXPONENTS; STRESS REGIME;

BINARY ALLOYS;

EID: 84860343849     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2012.03.093     Document Type: Article

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