Thermal effect characterization of laser-ablated silicon-through interconnect

ESTC 2006 - 1st Electronics Systemintegration Technology Conference

Volumn 1, Issue , 2006, Pages 594-599

  Chen, Yu Hua ^a   Lo, Wei Chung ^a   Kuo, Tzu Ying ^a  

^a INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

INDUCTIVELY COUPLED PLASMA; INTERCONNECTION NETWORKS; LASER ABLATION; SCANNING ELECTRON MICROSCOPY; THERMAL EFFECTS; ULTRAVIOLET RADIATION;

LASER DRILLING; REACTIVE ION BEAMS;

SILICON WAFERS;

EID: 42549133026     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2006.280064     Document Type: Conference Paper

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