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Journal of Electronic Materials

Volumn 36, Issue 7, 2007, Pages 783-797

Failure mechanisms and crack propagation paths in thermally aged Pb-free solder interconnects

(2) De Monlevade, Eduardo Franco a Peng, Weiqun b

a Nokia Technology Institute (INdT) (Brazil)

b NOKIA RESEARCH CENTER (United States)

Author keywords

Crack propagation; Fracture; Intermetallic compounds; Lead free soldering

Indexed keywords

CROSS SECTIONING; INTERPHASE BOUNDARIES; LEAD-FREE SOLDERING; PARTICULAR PATH;

CRACK PROPAGATION; FAILURE ANALYSIS; INTERMETALLICS; PHASE TRANSITIONS; THERMAL AGING;

ELECTRIC POWER SYSTEM INTERCONNECTION;

EID: 34547401936 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-006-0062-8 Document Type: Article

Times cited : (24)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.