SCOPUS 정보 검색 플랫폼

Volumn 39, Issue 12, 2010, Pages 2544-2552

Effects of minor Ni doping on microstructural variations and interfacial reactions in Cu/Sn-3.0Ag-0.5Cu-xNi/Au/Ni sandwich structures

(5) Yu, Chi Yang a Lee, Tae Kyu b Tsai, Michael b Liu, Kuo Chuan b Duh, Jenq Gong a

a NATIONAL TSING HUA UNIVERSITY (Taiwan)

b CISCO SYSTEMS (United States)

Author keywords

interfacial reaction; Ni doping; packaging; Pb free solders; soldering

Indexed keywords

BEFORE AND AFTER; EPMA; FIELD-EMISSION ELECTRONS; FORMATION MECHANISM; INTERFACIAL REACTIONS; INTERMETALLIC COMPOUNDS; MICROSTRUCTURAL VARIATION; MICROSTRUCTURE EVOLUTIONS; NI CONTENT; NI-DOPING; PB FREE SOLDERS;

ELECTRON PROBE MICROANALYSIS; INTERMETALLICS; LEAD; SANDWICH STRUCTURES; SILVER; SOLDERING; TIN;

SOLDERING ALLOYS;

EID: 78049529699 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-010-1372-4 Document Type: Conference Paper

Times cited : (33)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.