Asymmetrical solder microstructure in Ni/Sn/Cu solder joint

Scripta Materialia

Volumn 55, Issue 4, 2006, Pages 347-350

  Wang, S J ^a   Liu, C Y ^a  

^a NATIONAL CENTRAL UNIVERSITY   (Taiwan)

Author keywords

Packaging; Solder

Indexed keywords

MICROSTRUCTURE; NICKEL ALLOYS; PACKAGING;

ASYMMETRICAL SOLDER MICROSTRUCTURE; CONCENTRATION GRADIENT; SOLDER;

SOLDERED JOINTS;

COPPER; MICROSTRUCTURE; NICKEL; PACKAGING; SOLDERING; TIN;

EID: 33744825178     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.scriptamat.2006.04.027     Document Type: Article

References (14)

1. Miller L.F. in: Proceedings of the IEEE Electronic Components Conference (1968), IEEE, New York, NY 52
2. Marcotte V.C., and Koopman N.G. in: Proceedings of the Thirty-first IEEE Electronic Components Conference (1981), IEEE, New York, NY 157
3. Wang S.J., and Liu C.Y. J. Electron. Mater. 32 11 (2003) 1303
4. Liu C.Y., and Wang S.J. J. Electron. Mater. 32 1 (2003) L1
5. Chen S.W., Wu S.H., and Lee S.W. J. Electron. Mater. 32 11 (2003) 1188
6. Zeng K., and Tu K.N. Mater. Sci. Eng. R 38 (2002) 55
7. Tsai C.M., Luo W.C., Chang C.W., Shieh Y.C., and Kao C.R. J. Electron. Mater. 33 (2004) 1424
8. Kang S.K., Lauro P., Shih D.Y., Henderson D.W., Bartelo J., Gosselin T., Cain S.R., Goldsmith C., Puttlitz K., Hwang T.K., and Choi W.K. Mater. Trans. 45 3 (2004) 1
9. Bader W.G. Weld Res. Suppl. (1969) 551
10. Humpston G., and Jacobson D.M. Principles of Soldering and Brazing (1993), ASM International, Materials Park, OH
11. Chang-Ho Y., and Kwang-Lung L. J. Mater. Res. 20 3 (2005) 666
12. Kim K.S., Huh S.H., and Suganuma K. J. Alloys Compd. 352 (2003) 226
13. H.A.H. Steen, Swedish Institute for Metals Research, Report No. IM-1643 (1982).
14. Kang S.K., Shih D.Y., Leonard D., Henderson D.W., Gosselin T., Cho S., Yu J., and Choi W.K. JOM 56 (2004) 34