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Scripta Materialia

Volumn 65, Issue 9, 2011, Pages 783-786

Stabilization of hexagonal Cu6(Sn,Zn)5 by minor Zn doping of Sn-based solder joints

(2) Yu, Chi Yang a Duh, Jenq Gong a

a NATIONAL TSING HUA UNIVERSITY (Taiwan)

Author keywords

Intermetallic compound; Phase transformation; Solder; Thermal stability

Indexed keywords

HEXAGONAL STRUCTURES; JOINT INTERFACES; PHASE TRANSFORMATION; SN-BASED SOLDERS; SOLDER; THERMODYNAMIC CALCULATIONS; ZN DOPING;

CRYSTAL STRUCTURE; DIFFERENTIAL SCANNING CALORIMETRY; INTERMETALLICS; PHASE TRANSITIONS; SOLDERING ALLOYS; THERMAL AGING; THERMODYNAMIC STABILITY; X RAY DIFFRACTION; X RAY DIFFRACTION ANALYSIS; ZINC;

TIN;

EID: 80052788841 PISSN: 13596462 EISSN: None Source Type: Journal
DOI: 10.1016/j.scriptamat.2011.07.029 Document Type: Article

Times cited : (58)

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