Nanoindentation study of Zn-based Pb free solders used in fine pitch interconnect applications

Materials Science and Engineering: A

Volumn 423, Issue 1-2, 2006, Pages 57-63

  Kumar, K Mohan ^a,b   Kripesh, V ^b   Shen, Lu ^c   Zeng, Kaiyang ^a   Tay, Andrew A O ^a  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

^b INSTITUTE OF MICROELECTRONICS   (Singapore)

^c INSTITUTE OF MATERIALS RESEARCH AND ENGINEERING   (Singapore)

Author keywords

Growth morphology; Intermetallic compounds; Nanoindentation technique; Sn 8Zn 3Bi alloys

Indexed keywords

ELASTIC MODULI; HARDNESS; INDENTATION; INTERMETALLICS; MECHANICAL PROPERTIES; MICROHARDNESS; MICROSTRUCTURE; MORPHOLOGY; PHYSICAL PROPERTIES; SOLDERED JOINTS; TIN ALLOYS;

FINE PITCH INTERCONNECT APPLICATIONS; FREE SOLDERS; GROWTH MORPHOLOGY; NANOINDENTATION TECHNIQUE;

SOLDERING ALLOYS;

ELASTIC MODULI; HARDNESS; INDENTATION; INTERMETALLICS; MECHANICAL PROPERTIES; MICROHARDNESS; MICROSTRUCTURE; MORPHOLOGY; PHYSICAL PROPERTIES; SOLDERED JOINTS; SOLDERING ALLOYS; TIN ALLOYS;

EID: 33646488803     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2006.01.088     Document Type: Article

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