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Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science

Volumn 33, Issue 2, 2002, Pages 249-259

Creep at low stresses: An evaluation of diffusion creep and Harper-Dorn creep as viable creep mechanisms

(1) Langdon, Terence G a

a UNIVERSITY OF SOUTHERN CALIFORNIA (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; COMPRESSIVE STRESS; ELASTIC MODULI; GRAIN BOUNDARIES; HIGH TEMPERATURE TESTING; RECRYSTALLIZATION (METALLURGY); SCHEMATIC DIAGRAMS; VECTORS;

DIFFUSION CREEP; GRAIN BOUNDARY SLIDING; HARPER-DORN CREEP;

CREEP TESTING;

EID: 0036475071 PISSN: 10735623 EISSN: None Source Type: Journal
DOI: 10.1007/s11661-002-0087-4 Document Type: Conference Paper

Times cited : (85)

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