Effect of lanthanum doping on the microstructure of tin-silver solder alloys

Journal of Electronic Materials

Volumn 37, Issue 3, 2008, Pages 331-338

  Pei, Min ^a   Qu, Jianmin ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Lead free solder alloy; Quantitative microstructure study; Rare earth element

Indexed keywords

AGING TEMPERATURE; AGING TIME; LEAD-FREE SOLDER ALLOY; QUANTITATIVE MICROSTRUCTURE STUDY;

DOPING (ADDITIVES); GRAIN SIZE AND SHAPE; MICROSTRUCTURE; RARE EARTH ELEMENTS; THERMAL AGING; VOLUME FRACTION;

SOLDERING ALLOYS;

EID: 38349110491     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-007-0335-x     Document Type: Article

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