Thermal expansion of Cu6Sn5 and (Cu,Ni) 6Sn5

Journal of Materials Research

Volumn 26, Issue 20, 2011, Pages 2660-2664

  Mu, Dekui ^a   Read, Jonathan ^a   Yang, Yafeng ^a   Nogita, Kazuhiro ^a  

^a UNIVERSITY OF QUEENSLAND   (Australia)

Author keywords

[No Author keywords available]

Indexed keywords

DILATOMETRY; EQUILIBRIUM TEMPERATURES; HIGH TEMPERATURE; LOW TEMPERATURES; NI ADDITIONS; SYNCHROTRON X RAY DIFFRACTION; VOLUME EXPANSION;

EXPANSION; INTERMETALLICS; TIN; X RAY DIFFRACTION;

THERMAL EXPANSION;

EID: 80053228552     PISSN: 08842914     EISSN: 20445326     Source Type: Journal    
DOI: 10.1557/jmr.2011.293     Document Type: Article

References (19)

1. T. Laurila, V. Vuorinen, and J.K. Kivilahti: Interfacial reactions between lead-free solders and common base materials. Mater. Sci. Eng., R 49, 1 (2005).
2. Y.C. Chan and D. Yang: Failure mechanisms of solder interconnect under current stressing in advanced electronic packages. Prog. Mater. Sci. 55, 428 (2010).
3. N. Jiang, J.A. Clum, R.R. Chromik, and E.J. Cotts: Thermal expansion of several Sn-based intermetallic compounds. Scr. Mater. 37, 1851 (1997).
4. K-K. Wang, D. Gan, K-C. Hsieh, and S-Y. Chiou: The microstructure of g'-Cu6Sn5 and its orientation relationships with Cu in the early stage of growth. Thin Solid Films 518, 1667 (2010).
5. W. Zhou, L. Liu, and P. Wu: Structural, electronic and thermoelastic properties of Cu6Sn5 and Cu5Zn8 intermetallic compounds: First-principles investigation. Intermetallics 18, 922 (2010).
6. K. Nogita, C.M. Gourlay, and T. Nishimura: Cracking and phase stability in reaction layers between Sn-Cu-Ni solders and Cu substrates. JOM 61, 45 (2009).
7. K. Nogita, S.D. McDonald, H. Tsukamoto, J. Read, S. Suenaga, and T. Nishimura: Inhibiting cracking of interfacial Cu6Sn5 by Ni additions to Sn-based lead-free solders. Trans. Jpn. Inst. Electron. Packag. 2, 46 (2009).
8. T. Laurila, J. Hurtig, V. Vuorinen, and J.K. Kivilahti: Effect of Ag, Fe, Au and Ni on the growth kinetics of Sn-Cu intermetallic compound layers. Microelectron. Reliab. 49, 242 (2009).
9. F. Gao, T. Takemoto, and H. Nishikawa: Morphology and growth pattern transition of intermetallic compounds between Cu and Sn-3.5 Ag containing a small amount of additives. J. Electron. Mater. 35, 2081 (2006).
10. C.Yu, J. Liu, H. Lu,P.Li, and J.Chen: First-principles investigationof the structural and electronic properties of Cu6-xNixSn5 (x5 0, 1, 2) intermetallic compounds. Intermetallics 15, 1471 (2007).
11. L. Xu and J.H.L. Pang: Nano-indentation characterization of Ni-Cu-Sn IMC layer subject to isothermal aging. Thin Solid Films 504, 362 (2006).
12. D. Mu, H. Tsukamoto, H. Huang, and K. Nogita: Formation and mechanical properties of intermetallic compounds in Sn-Cu hightemperature lead-free solder joints. Mater. Sci. Forum 654, 2450 (2010).
13. A.K. Larsson, L. Stenberg, and S. Lidin: The superstructure of domain-twinned g'-Cu6Sn5. Acta Crystallogr. B 50, 636 (1994).
14. K. Nogita and T. Nishimura: Nickel-stabilized hexagonal (Cu, Ni)6Sn5 in Sn-Cu-Ni lead-free solder alloys. Scr. Mater. 29, 191 (2008).
15. K. Nogita: Stabilisation of Cu6Sn5 by Ni in Sn-0.7 Cu-0.05 Ni leadfree solder alloys. Intermetallics 18, 145 (2010).
16. U. Schwingenschlögl, C. Di Paola, K. Nogita, and C.M. Gourlay: The influence of Ni additions on the relative stability of g and g' Cu6Sn5. Appl. Phys. Lett. 96, 061908 (2010).
17. F. Izumi and K. Momma: Three-dimensional visualization in powder diffraction. Solid State Phenom. 130, 15 (2007).
18. G. Ghosh and M. Asta: Phase stability, phase transformations, and elastic properties of Cu6Sn5: Ab initio calculations and experimental results. J. Mater. Res. 20, 3102 (2005).
19. H.F. Zou, H.J. Yang, and Z.F. Zhang: Morphologies, orientation relationships and evolution of Cu6Sn5 grains formed between molten Sn and Cu single crystals. Acta Mater. 56, 2649 (2008).