SCOPUS 정보 검색 플랫폼

Materials Science Forum

Volumn 654-656, Issue , 2010, Pages 2450-2454

Formation and mechanical properties of intermetallic compounds in Sn-Cu high-temperature lead-free solder joints

(4) Mu, Dekui a Tsukamoto, Hideaki a Huang, Han a Nogita, Kazuhiro a

a UNIVERSITY OF QUEENSLAND (Australia)

Author keywords

High temperature lead free solders; Intermetallic compounds; Mechanical properties; Nanoindentation

Indexed keywords

BINARY ALLOYS; COPPER ALLOYS; INTERMETALLICS; MECHANICAL PROPERTIES; NANOINDENTATION; NICKEL; SCANNING ELECTRON MICROSCOPY; SOLDERED JOINTS; TIN ALLOYS;

ELECTRONIC DEVICE; HIGH TEMPERATURE; LEAD-BASED SOLDERS; LEAD-FREE SOLDER JOINT; LEGISLATIVE REQUIREMENTS; NICKEL ADDITION; SUBSTRATE INTERFACE;

LEAD-FREE SOLDERS;

EID: 77955483665 PISSN: 02555476 EISSN: 16629752 Source Type: Book Series
DOI: 10.4028/www.scientific.net/MSF.654-656.2450 Document Type: Conference Paper

Times cited : (13)

References (12)

1
- 17644424847
- McGraw-Hill
- J. Hwang: Implementing lead-free Electronics (McGraw-Hill, 2004).
- (2004) Implementing Lead-free Electronics
- Hwang, J.¹

2
- 67649429462
- K. Suganuma, S. Kim, and K. Kim: J. Miner. Met. Mater. Soc. Vol. 61(2009), p. 64.
- (2009) J. Miner. Met. Mater. Soc. , vol.61 , pp. 64
- Suganuma, K.¹ Kim, S.² Kim, K.³

3
- 70349745521
- K. Nogita, C. Gourlay, and T. Nishimura: J. Miner. Met. Mater. Soc. Vol. 61(2009) p. 45.
- (2009) J. Miner. Met. Mater. Soc. , vol.61 , pp. 45
- Nogita, K.¹ Gourlay, C.² Nishimura, T.³

4
- 74449086197
- C. Gourlay, K. Nogita, J. Read, and A.K. Dahle: J. Electron. Mater. Vol. 39(2010), p. 56.
- (2010) J. Electron. Mater. , vol.39 , pp. 56
- Gourlay, C.¹ Nogita, K.² Read, J.³ Dahle, A.K.⁴

5
- 37249000886
- T. Ventura, C. Gourlay, K. Nogita, T. Nishimura, M. Rappaz, and A.K. Dahle: J. Electron. Mater. Vol. 37(2008), p. 32.
- (2008) J. Electron. Mater. , vol.37 , pp. 32
- Ventura, T.¹ Gourlay, C.² Nogita, K.³ Nishimura, T.⁴ Rappaz, M.⁵ Dahle, A.K.⁶

6
- 77953131776
- K. Nogita, S. D. McDonald, H. Tsukamoto, J. Read, S. Suenaga, and T. Nishimura: Trans. Jpn. Inst. Electron. Packag. Vol. 2(2009), p.46.
- (2009) Trans. Jpn. Inst. Electron. Packag. , vol.2 , pp. 46
- Nogita, K.¹ McDonald, S.D.² Tsukamoto, H.³ Read, J.⁴ Suenaga, S.⁵ Nishimura, T.⁶

7
- 33748901342
- H. Huang, K. J. Winchester, A. Suvorova, B. R. Lawn, Y. Liu, X. Z. Hu, J. M. Dell, and L. Faraone:Mater. Sci. Eng. A. Vol. 435(2006), p. 453.
- (2006) Mater. Sci. Eng. A. , vol.435 , pp. 453
- Huang, H.¹ Winchester, K.J.² Suvorova, A.³ Lawn, B.R.⁴ Liu, Y.⁵ Hu, X.Z.⁶ Dell, J.M.⁷ Faraone, L.⁸

8
- 33645537269
- F. Gao, T. Takemoto, and H. Nishikawa: Mater. Sci. Eng. A. Vol. 420(2006), p. 39.
- (2006) Mater. Sci. Eng. A. , vol.420 , pp. 39
- Gao, F.¹ Takemoto, T.² Nishikawa, H.³

9
- 10444239763
- Butterworth-Heinemann
- W.F. Gale, T.C. Totemeier, and C.J. Smithells: Smithells metals reference book (Butterworth-Heinemann, 2004).
- (2004) Smithells Metals Reference Book
- Gale, W.F.¹ Totemeier, T.C.² Smithells, C.J.³

10
- 42249114675
- P. F. Yang, Y. S. Lai, S. R. Jian, J. Chen, and R. S. Chen: Mater. Sci. Eng. A. Vol. 485(2008), p. 305.
- (2008) Mater. Sci. Eng. A. , vol.485 , pp. 305
- Yang, P.F.¹ Lai, Y.S.² Jian, S.R.³ Chen, J.⁴ Chen, R.S.⁵

11
- 67651151030
- H. Tsukamoto, Z. Dong, H. Huang, T. Nishimura, and K. Nogita: Mater Sci Eng B, Vol. 164 (2009), p. 44.
- (2009) Mater Sci Eng B , vol.164 , pp. 44
- Tsukamoto, H.¹ Dong, Z.² Huang, H.³ Nishimura, T.⁴ Nogita, K.⁵

12
- 33644913104
- L. Xu, and J. Pang: Thin. Solid. Films. Vol. 504 (2006), p. 362.
- (2006) Thin. Solid. Films , vol.504 , pp. 362
- Xu, L.¹ Pang, J.²

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.