Nanoindentation identifications of mechanical properties of Cu6Sn5, Cu3Sn, and Ni3Sn4 intermetallic compounds derived by diffusion couples

Materials Science and Engineering: A

Volumn 485, Issue 1-2, 2008, Pages 305-310

  Yang, Ping Feng ^a,b   Lai, Yi Shao ^a   Jian, Sheng Rui ^c   Chen, Jiunn ^a   Chen, Rong Sheng ^b  

^a ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

^b NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

^c I SHOU UNIVERSITY   (Taiwan)

Author keywords

Hardness; Intermetallic compound (IMC); Nanoindentation; Strain rate; Young's modulus

Indexed keywords

ANNEALING; COPPER COMPOUNDS; DIFFUSION; ELASTIC MODULI; HARDNESS; NANOINDENTATION; NICKEL COMPOUNDS; POLYCRYSTALLINE MATERIALS; STRAIN RATE;

MULTIPLE POP-IN EVENT; RESIDUAL IMPRESSION;

INTERMETALLICS;

ANNEALING; COPPER COMPOUNDS; DIFFUSION; ELASTIC MODULI; HARDNESS; INTERMETALLICS; NANOINDENTATION; NICKEL COMPOUNDS; POLYCRYSTALLINE MATERIALS; STRAIN RATE;

EID: 42249114675     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2007.07.093     Document Type: Article

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