The effects of stress state, loading frequency and cyclic waveforms on the fatigue behavior of silver-filled electronically-conductive adhesive joints

Journal of Adhesion Science and Technology

Volumn 20, Issue 1, 2006, Pages 53-68

  Gomatam, Rajesh R ^a   Sancaktar, Erol ^b  

^a Lehigh University   (United States)

^b University of Akron   (United States)

Author keywords

Crack growth; Cyclic creep; Cyclic frequency; Cyclic loading; Electronically conductive adhesives; Elevated humidity; Elevated temperature; Endurance limit; Fatigue; Fracture; Mode I; Mode III; P N curve; Rate effect; Stress state; Waveform

Indexed keywords

ADHESIVES; CRACK PROPAGATION; CREEP; CYCLIC LOADS; FATIGUE OF MATERIALS; STRESS ANALYSIS; WAVEFORM ANALYSIS; ADHESIVE JOINTS; ELECTRIC CONDUCTIVITY; FRACTURE;

CYCLIC CREEP; CYCLIC FREQUENCY; ELECTRONICALLY CONDUCTIVE ADHESIVES; ELEVATED HUMIDITY; ELEVATED TEMPERATURE; P-N CURVE; RATE EFFECT; STRESS STATE;

JOINTS (STRUCTURAL COMPONENTS); STRESS ANALYSIS;

CYCLIC CREEP; CYCLIC FREQUENCY; CYCLIC LOADINGS; ELECTRONICALLY CONDUCTIVE ADHESIVES; ELEVATED HUMIDITY; ELEVATED TEMPERATURE; ENDURANCE LIMIT; MODE-I; MODE-III; P-N CURVE; RATE EFFECTS; STRESS STATE; WAVE FORMS;

EID: 33645074926     PISSN: 01694243     EISSN: None     Source Type: Journal    
DOI: 10.1163/156856106775212378     Document Type: Article

References (23)

1. C. P. Wong, in: Polymers for Electronic and Photonic Applications, C. P. Wong (Ed.), pp. 167-220. Academic Press, New York, NY (1993).
2. K. X. Hu, C. P. Yeh and K. W. Wyatt, in: Proc. 2nd Int. Symp. on Electronics Packaging Technology, Shanghai, China, pp. 110-119 (1996).
3. B. D. Harper, L. Lu and V. H. Kenner, Adv. Electron. Packag. 19, 291 (1997).
4. J. H. Lau, Flip Chip Technologies. McGraw-Hill, New York, NY (1996).
5. R. R. Gomatam and E. Sancaktar, J. Adhesion Sci. Technol. 18, 731 (2004).
6. R. R. Gomatam and E. Sancaktar, J. Adhesion Sci. Technol. 18, 849 (2004).
7. R. R. Gomatam and E. Sancaktar, J. Adhesion Sci. Technol. 18, 1833 (2004).
8. R. R. Gomatam, Modeling fatigue behavior of electronically conductive adhesives. PhD Dissertation, The University of Akron, Akron, OH (2002).
9. M. Imanaka and T. Iwata, J. Adhesion 59, 111 (1996).
10. A. D. Crocombe and G. Richardson, Int. J. Adhesion Adhesives 19, 19 (1999).
11. C. T. Sun and W. S. Chan, in: Testing and Design, ASTM STP 674, S. W. Tsai (Ed.), p. 418. ASTM, Philadelphia, PA (1979).
12. K. L. Rein, W. W. Stinchcomb and T. K. O'Brien, in: Fatigue of Filamentary Composite Materials, ASTM STP 636, K. L. Reifsnider and K. N. Lauraitis (Eds), p. 171. ASTM, Philadelphia, PA (1977).
13. J. W. Dally and L. J. Broutman, J. Composite Mater. I, 424 (1967).
14. E. Dan-Jumba, S. G. Zhou and C. T. Sun, in: Advances in Thermoplastic Matrix Composite Materials, ASTM STP 1044, G. M. Newaz (Ed.), p. 113. ASTM, West Conshohocken, PA (1989).
15. D. C. Curtis, D. R. Moore, B. Slater and N. Zahlan, Composites 19, 446 (1988).
16. X. R. Xiao and I. Al-Hmouz, in: Proceedings of ICCM-11, Gold Coast, Australia, Vol. 2, p. 124 (1977).
17. E. G. Knauss, Appl. Mech. Rev. 26, 1 (1973).
18. R. Kilik and R. Davies, Int. J. Adhesion Adhesives 8, 224 (1989).
19. M. A. Smith and R. Hardy, Composites 8, 255 (1977).
20. J. A. Marceau, Adhesives Age 21 (April), 37 (1978).
21. X. X. Xu, A. D. Crocombe and P. A. Smith, J. Adhesion 58, 191 (1996).
22. A. H. Al-Ghamdi, I. A. Ashcroft, A. D. Crocombe and M. M. Abdel-Wahab, J. Adhesion 79, 1161 (2003).
23. X. R. Xiao, J. Composite Mater. 33, 1141 (1999).