Dependence of electrical conduction on the film thickness of conductive adhesives: Modeling, computer simulation, and experiment

Journal of Adhesion Science and Technology

Volumn 10, Issue 11, 1996, Pages 1199-1219

  Yong Wei, ^a   Sancaktar, Erol ^a  

^a Clarkson University   (United States)

Author keywords

2 D conduction; Adhesive thickness; Anisotropic electric conduction; Conduction modeling; Conductive paths; Contact resistance; Electrical resistivity; Electronically conductive adhesives; Silver filled adhesives

Indexed keywords

ADHESIVES; ANISOTROPY; COMPUTER SIMULATION; ELECTRIC CONDUCTIVITY OF SOLIDS; ELECTRIC RESISTANCE; MATHEMATICAL MODELS; PARAMETER ESTIMATION; VOLUME FRACTION; COMPUTATIONAL METHODS; CONTACT RESISTANCE; ELECTRIC CONDUCTIVITY; THIN FILMS;

ADHESIVE THICKNESS; ANISOTROPIC ELECTRIC CONDUCTION; CONTACT RESISTANCE; ELECTRONICALLY CONDUCTIVE ADHESIVES; SILVER FILLED ADHESIVES; TWO DIMENSIONAL ELECTRIC CONDUCTION;

CONDUCTIVE FILMS; THREE DIMENSIONAL;

ADHESIVE THICKNESS; CONDUCTIVE PATHS; ELECTRIC CONDUCTION; ELECTRICAL RESISTIVITY; ELECTRONICALLY CONDUCTIVE ADHESIVES;

EID: 0030380213     PISSN: 01694243     EISSN: 15685616     Source Type: Journal    
DOI: 10.1163/156856196X00193     Document Type: Article

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