Correlation of silver migration to the pull out strength of silver wire embedded in an adhesive matrix

IEEE Transactions on Components and Packaging Technologies

Volumn 28, Issue 4, 2005, Pages 771-780

  Sancaktar, Erol ^a   Rajput, Pankaj ^b   Khanolkar, Amit ^c  

^a University of Akron   (United States)

^b INDIAN INSTITUTE OF TECHNOLOGY DELHI   (India)

^c JOHNSON AND JOHNSON   (United States)

Author keywords

Electronically conductive adhesives (ECAs); Silver migration phenomenon; Tin lead (Sn Pb) solders

Indexed keywords

ADHESIVES; BOND STRENGTH (MATERIALS); ELECTRIC CONDUCTIVITY; ELECTRIC WIRE; ENCAPSULATION; PRINTED CIRCUIT BOARDS; SCANNING ELECTRON MICROSCOPY; SILVER; SOLDERED JOINTS; SOLDERING ALLOYS; SURFACE MOUNT TECHNOLOGY;

ELECTRICAL JOINTS; ELECTRONICALLY CONDUCTIVE ADHESIVES; PULL OUT STRENGTH; SILVER MIGRATION; WIRE BONDING APPLICATIONS;

CONDUCTIVE MATERIALS;

EID: 29244470286     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2005.859752     Document Type: Article

References (6)

1. E. Sancaktar, Y. Wei, and M. A. Gaynes, "Conduction efficiency and strength of electronically conductive adhesive joints," J. Adhesion, vol. 56, p. 229. 1996.
2. J. Bolger, M. Herberg, and C. Menu, "Silicone coatings to prevent silver migration in hybrid circuits," in Proc. 1st Int. SAMPE Electron. Conf., 1987, p. 616.
3. E. Sancaktar and Y. Wei, Mittal Festschrift on Adhesion Science and Technology, W. J. van Ooij and H. Anderson, Eds. Utrecht, The Netherlands: VSP, 1998, p. 509.
4. D. Hull, An Introduction to Composite Materials. Cambridge, U.K.: Cambridge Univ. Press, 1988.
5. E. Sancaktar and A. Khanolkar, "Effect of interfacial weight loss by silver migration on the pullout strength of silver wire embedded in an adhesive matrix," J. Adhesion Sci. Technol., vol. 15, pp. 1221-1245, 2001.
6. E. Sancaktar and P. Rajput, "Reliability, stress analysis and failure prevention," in Proc. ASME Int. Design Engineering Technical Conf. Computers Information Engineering Conf., 2003, CD ROM.