Modeling filler volume fraction and film thickness effects on conductive adhesive resistivity

2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics

Volumn , Issue , 2004, Pages 38-49

  Sancaktar, Erol ^a   Bai, Lan ^a  

^a The University of Akron   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CONDUCTIVE FILLERS; ELECTRICALLY CONDUCTIVE ADHESIVES (ECA); FILM THICKNESS; SURFACE OXIDE LAYERS;

COMPOSITE MATERIALS; ELECTRIC CONDUCTIVITY; ELECTRONICS PACKAGING; EPOXY RESINS; FILLERS; PARTICLE SIZE ANALYSIS; SOLDERING; SURFACE TREATMENT; VISCOSITY; VOLUME FRACTION;

ADHESIVES;

EID: 17044437017     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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