Flip chip bonding using isotropically conductive adhesives

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1996, Pages 578-581

  Roesner, Bela ^a   Liu, Johan ^a   Lai, Zonghe ^a  

^a Thomson Multimedia   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; ALUMINA; BONDING; FLIP CHIP DEVICES; INTEGRATED CIRCUIT LAYOUT; INTEGRATED CIRCUIT TESTING; INTERCONNECTION NETWORKS; RELIABILITY; SILVER; SUBSTRATES; THERMAL CYCLING;

ADHESIVE BUMPS; ISOTROPICALLY CONDUCTIVE ADHESIVES; SILVER MIGRATION;

CONDUCTIVE MATERIALS;

EID: 0029709215     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (7)