On the failure mechanism of anisotropically conductive adhesive joints on copper metallisation

International Journal of Adhesion and Adhesives

Volumn 16, Issue 4, 1996, Pages 285-287

  Liu, J ^a  

^a IVF Swed Inst of Prod Eng Res   (Sweden)

Author keywords

Anisotropically conductive adhesive; Crack growth; Electrical resistance; Failure mechanism; Humidity test; Oxidation

Indexed keywords

ADHESION; ANISOTROPY; COPPER; CRACK PROPAGATION; ELECTRIC CONDUCTIVITY OF SOLIDS; FAILURE (MECHANICAL); OXIDATION; THEORY;

ANISOTROPICALLY CONDUCTIVE ADHESIVE JOINTS;

ADHESIVE JOINTS;

EID: 0030288469     PISSN: 01437496     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0143-7496(96)00016-4     Document Type: Article

References (7)

1. Liu, J. Proc. of the 1st Int. Conf. on Adhesive Joining Technology in Electronics Manufacturing, Berlin, Germany, VDE/VDI-Verlag gmbh, 2-4 November 1994
2. Hutton, M. BPA report No 535, BPA (Technology & Management) Inc., UK, January 1994
3. Rörgren, R. and Liu, J. IEEE Trans. Components. Packaging and Manufacturing Technology - Part B 1995, 18, 305
4. Klosterman, D., Rak, S., Wille, S., Dubinski, D. and Desai, P. Proc. 1st Int. Conf. on Adhesive Joining Technology in Electronics Manufacturing, Berlin, Germany. VDE/VDI-Verlag gmbh, 2-4 November
5. Liu, J., Ljungkrona, L. and Lai, Z.-H. IEEE transactions of Components, Packaging and Manufacturing Technology - Part B 1995, 18, 313
6. Li, L., Morris, J., Liu, J., Lai, Z.-H., Ljungkrona, L. and Li, C. Proc. of the 45th Electronic Components Technology Conference, Las Vegas, USA, 21-24 May 1995, p. 114
7. Carmichael, R.S., Handbook of Physical Properties of Rocks, Vol. I, CRC Press, Boca Raton, Florida, 1994