Fatigue and failure behaviors of silver-filled electronically-conductive adhesive joints subjected to elevated humidity

Journal of Adhesion Science and Technology

Volumn 18, Issue 15-16, 2004, Pages 1833-1848

  Gomatam, Rajesh R ^a   Sancaktar, Erol ^b  

^a Lehigh University   (United States)

^b University of Akron   (United States)

Author keywords

Accelerated humidity testing; Crack growth; Cyclic creep; Cyclic loading; Electronically conductive adhesives; Elevated humidity fatigue; Endurance limit; Fracture; Joint conductivity; Joint integrity; Mode i; Mode iii; P n curve; Rate effect

Indexed keywords

ATMOSPHERIC HUMIDITY; CYCLIC LOADS; DIELECTRIC MATERIALS; ELECTRONICS PACKAGING; FATIGUE OF MATERIALS; POLYMERS; SILVER; ADHESIVE JOINTS; CRACK PROPAGATION; ELECTRIC CONDUCTIVITY; FRACTURE; STAINLESS STEEL;

ELECTRONICALLY CONDUCTIVE ADHESIVES; ELEVATED HUMIDITY FATIGUE; ENDURANCE LIMIT; JOINT CONDUCTIVITY; JOINT INTEGRITY;

ADHESIVE JOINTS; FATIGUE TESTING;

CYCLIC CREEP; CYCLIC LOADINGS; ELECTRONICALLY CONDUCTIVE ADHESIVES; ELEVATED HUMIDITY FATIGUE; ENDURANCE LIMIT; JOINT CONDUCTIVITY; JOINT INTEGRITY; MODE III; RATE EFFECTS;

EID: 13444257693     PISSN: 01694243     EISSN: None     Source Type: Journal    
DOI: 10.1163/1568561042708322     Document Type: Article

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